| EPE 2023 - Topic 01: Devices, Packaging and System Integration |
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 | EPE 2023 - DS1a: Active Devices and Components (Si) |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Active Devices and Components (Si) |
| | EPE 2023 - DS1b: Active Devices and Components (Wide Bandgap and other New Materials) |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Active Devices and Components (Wide Bandgap and other New Materials) |
| | EPE 2023 - DS1c: System Integration, Packaging & Thermal Management |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session System Integration, Packaging & Thermal Management |
| | EPE 2023 - DS2a: Passive Components |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Passive Components |
| | EPE 2023 - DS2b: Components and Devices for Specific Applications, including for Pulsed Power |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Components and Devices for Specific Applications, including for Pulsed Power |
| | EPE 2023 - DS2c: System Integration, Packaging & Thermal Management |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session System Integration, Packaging & Thermal Management |
| | EPE 2023 - DS2d: Reliability & Life-Time |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Reliability & Life-Time |
| | EPE 2023 - LS1b: Active Devices and Components (Si) |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Active Devices and Components (Si) |
| | EPE 2023 - LS2b: Active Devices and Components (Wide Bandgap and other New Materials) |
|
| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Active Devices and Components (Wide Bandgap and other New Materials) |
| | EPE 2023 - LS3b: Passive Components, System Integration, Packaging & Thermal Management |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Passive Components, System Integration, Packaging & Thermal Management |
| | EPE 2023 - LS4b: Reliability & Life-Time |
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| In this category, you will find the papers presented at the EPE '23 ECCE Europe Conference, which took place in Aalborg, Denmark, during the session Reliability & Life-Time |