EPE Association: EPE 2023 - LS3b: Passive Components, System Integration, Packaging & Thermal Management

EPE 2023 - LS3b: Passive Components, System Integration, Packaging & Thermal Management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2023 ECCE Europe - Conference > EPE 2023 - Topic 01: Devices, Packaging and System Integration > EPE 2023 - LS3b: Passive Components, System Integration, Packaging & Thermal Management

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   Binary-weighted Modular Multi-level Digital Active Gate Driver
By Hajime TAKAYAMA, Shuhei FUKUNAGA, Takashi HIKIHARA [View]
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Abstract: This paper proposes a modular multi-level digital active gate driver topology consisting of several submodules with binary-weighted voltages. It can coordinate both the dynamic and the static behavior of SiC MOSFETs by shaping the gate voltage waveform using 15 voltage levels, which is particularly beneficial in parallel operation of the power devices. It is verified that the proposed gate driver can improve the current-sharing performance of parallel-connected SiC MOSFETs under several usually undesired conditions with mismatched parameters.

   Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling
By Asger BJØRN JØRGENSEN, Szymon BECZKOWSKI, Benjamin FUTTRUP KJÆRSGAARD, Thore STIG AUNSBORG, Stig MUNK-NIELSEN, Hongbo ZHAO [View]
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Abstract: A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.

   On the Impact of DC Magnetization on Core Losses: A Model Based on Extensive Experimental Results from the MagNet Database
By Asier ARRUTI, Iosu AIZPURU, Mikel MAZUELA [View]
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Abstract: In this work, an analysis of DC magnetization core loss modelling based on experimental core loss data is presented. First, an analysis of the available core loss data from the MagNet database is presented, where the dependencies of the losses in regards of frequency, flux density, and DC magnetization are demonstrated. Then, an equation resembling the displacement factor is introduced to model the effect of the DC magnetization in the losses. Using the experimental data available from the MagNet core loss database, the necessary coefficients to define the losses are extracted, and fitted to polynomial planes as functions of frequency and flux density. Lastly, the model is validated presenting a detailed analysis of the model accuracy at different conditions.

EPE 2023 - LS3b: Passive Components, System Integration, Packaging & Thermal Management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2023 ECCE Europe - Conference > EPE 2023 - Topic 01: Devices, Packaging and System Integration > EPE 2023 - LS3b: Passive Components, System Integration, Packaging & Thermal Management
	[return to parent folder]

	Binary-weighted Modular Multi-level Digital Active Gate Driver By Hajime TAKAYAMA, Shuhei FUKUNAGA, Takashi HIKIHARA	[View] [Download]
Abstract: This paper proposes a modular multi-level digital active gate driver topology consisting of several submodules with binary-weighted voltages. It can coordinate both the dynamic and the static behavior of SiC MOSFETs by shaping the gate voltage waveform using 15 voltage levels, which is particularly beneficial in parallel operation of the power devices. It is verified that the proposed gate driver can improve the current-sharing performance of parallel-connected SiC MOSFETs under several usually undesired conditions with mismatched parameters.

	Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling By Asger BJØRN JØRGENSEN, Szymon BECZKOWSKI, Benjamin FUTTRUP KJÆRSGAARD, Thore STIG AUNSBORG, Stig MUNK-NIELSEN, Hongbo ZHAO	[View] [Download]
Abstract: A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.

	On the Impact of DC Magnetization on Core Losses: A Model Based on Extensive Experimental Results from the MagNet Database By Asier ARRUTI, Iosu AIZPURU, Mikel MAZUELA	[View] [Download]
Abstract: In this work, an analysis of DC magnetization core loss modelling based on experimental core loss data is presented. First, an analysis of the available core loss data from the MagNet database is presented, where the dependencies of the losses in regards of frequency, flux density, and DC magnetization are demonstrated. Then, an equation resembling the displacement factor is introduced to model the effect of the DC magnetization in the losses. Using the experimental data available from the MagNet core loss database, the necessary coefficients to define the losses are extracted, and fitted to polynomial planes as functions of frequency and flux density. Lastly, the model is validated presenting a detailed analysis of the model accuracy at different conditions.