EPE Association: EPE 2022 - DS1d: Reliability & Life-Time

EPE 2022 - DS1d: Reliability & Life-Time
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2022 ECCE Europe - Conference > EPE 2022 - Topic 01: Devices, Packaging and System Integration > EPE 2022 - DS1d: Reliability & Life-Time

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   Comparative Lifetime Estimations for IGBT Modules in Wind Turbine Converters
By Christian NEUMANN [View]
[Download]

Abstract: Comparative IGBT lifetime estimations for a generic wind turbine are presented. A thermal impedancematrix is utilized for thermal modeling, addressing thermal cross-coupling effects within the IGBTmodules. For the estimation procedure, all temperature swings are calculated with a high temporalresolution, allowing the correct superposition of each swing.

   Comparison of Power Cycling Results of discrete GaN Cascodes for Automotive Power Electronics with high Temperature Swings
By Florian LIPPOLD [View]
[Download]

Abstract: High voltage rated GaN HEMTs are attractive for automotive applications such as on-board charger orauxiliary power supplies. Nowadays GaN is packaged as single chips in discrete housings. In this papera power cycling set up and results for GaN components in discrete TO-247 package are presented.

   Design of a High-Dynamic Test Bench for Accelerated Dielectric LifetimeTesting with adjustable Voltage Slopes and Temperatures
By Hendrik SCHEFER [View]
[Download]

Abstract: Upcoming future mobility will require high power densities; therefore, wide bandgap semiconductors(WBGs) and HVDC supply voltage could be one solution. One crucial design criterion is the insulationcoordination in all drive train components. This paper presents and discusses a test bench design toemulate dielectric stress due to fast switching and hard switching WBGs at high voltages and variousenvironmental conditions.

   Dynamic Load Emulation for Automotive Power IC Robustness Validation
By Alexander ULBING [View]
[Download]

Abstract: This paper addresses the gap in application related stress testing for automotive power IC qualifications as well as for development-related testing to make ICs more robust. To make test systems more efficient and reduce the cost per test slot the concept of dynamic load emulation has been evaluated. An approach taken by industrial power converters has been adapted to fit the needs of the low power automotive drive domain. To prove the concept and show how application relevant stress could be applied to the device under test simulations are done. In a further step a dedicated hardware test bench has been created and the applicability of the concept within the automotive domain was verified. Several measurements are shown to demonstrate the functionality as well as possible improvements and next steps are discussed.

   Extension and Implementation of a Model-based Lifetime Monitoring System with Parallel Calculation of Multiple Power Semiconductors
By Steffen MENZEL [View]
[Download]

Abstract: The importance of power electronics for future energy supply is steadily increasing. This implies a lot of semiconductor-based power converters and thus, a huge number of power semiconductors. Their operational availability becomes a critical feature of the power converters. Therefore, predictable maintenance is a key element for a stable and reliable energy supply. A new approach for a FPGA based implementation of a lifetime model for parallel monitoring of semiconductors will be presented.

   Impact of Bond Wire Configuration on the Power Cycling Capability of Discrete SiC-MOSFET Devices
By Patrick HEIMLER [View]
[Download]

Abstract: This work investigates the power cycling capability of SiC MOSFETs (60 mO/1200 V) in TO-247-packages with two different bonding configurations. As a result, a difference in lifetime by a factor of1.5 to 2 is determined. The failure mode was an increase in forward voltage drop by degradation of thebond wire connection. The ANSYS simulations (thermal-electrical and mechanical) confirm thatseveral thinner bond wires have a higher power cycling capability compared to a few bond wires withlarger diameters.

   Investigation of Creepage Distances on Printed Circuit Boards for Avionic Applications
By Hendrik SCHEFER [View]
[Download]

Abstract: Avionic power electronic applications need enormous power densities (10 kW/kg inf.) under high reliability to enable a high level of electrification. An increase in the DC bus voltage and high switching frequencies due to WBGs is unavoidable. An improved level of integration of these WBGs is needed to meet the aviation specific requirements regarding weight. Thus, this paper focuses on determining the breakdown voltage induced by DC voltages on printed circuit boards to show new design possibilities for future.

   Magnetic Core Evaluation Kit for the Comparison of Core Losses
By Wilmar MARTINEZ [View]
[Download]

Abstract: Within an initiative of different scientific and industrial partners, a comparison of measurement, analytical, and numerical methods for core losses is conducted. Consequently, a core evaluation kit was developed and used in different parts of the world to evaluate the effects of size, shapes, and measurement practices on the core loss models that we use for power conversions systems. In this paper, the fluxometric fpur-wire characterization method was used to characterize ferrite and nanocrystalline materials using different sizes, flux densities, supply voltages, and switching frequencies. It was found that using the same magnetic material, magnetic components have different iron loss properties when the size of the core is changed. These results are the very first of many procedures and tests with this initiative of the magnetic core evaluation kit. And it is expected to contribute to have a common and better understanding of core/iron losses of magnetic components in power electronics.

   Online Junction Temperature Measurement of SiC-MOSFETs via Gate Impedance Using the Gate-Signal Injection Method
By David HIRNING [View]
[Download]

Abstract: This paper presents a method for junction temperature monitoring of SiC-MOSFETs based on a high-frequency gate-signal injection. The signal is injected during steady state (e.g. off-state) resulting in a current response, which depends on the temperature dependent gate impedance. The external gate resistor is used as a current shunt to capture the current response. The resulting signal contains the junction temperature information due to the temperature dependency of the gate impedance. This paper focuses on a sinusoidal approach to overcome the challenges due to the temperature dependent parasitic capacitance of the gate circuit. Measurements show the proof of concept, however, there are still challenges to face.

   Powercycling Test Bench with Realistic Loss Distribution and Temperature Ripples
By Till-Mathis PLÖTZ [View]
[Download]

Abstract: An innovative test bench is presented, which allows the powercycling for semiconductors under a super-position of temperature ripples with different frequencies. In addition to the implementation of switchinglosses, this creates loadpatterns which are similar to the application. Further, the leakage current of thesemiconductors as a thermo-sensitive parameter is introduced. First results validate the concept.

   Response of IGBT chip characteristics due to critical mechanical stress
By Kohei YAMAUCHI [View]
[Download]

Abstract: Focusing on the change in power semiconductor chip characteristics in response to mechanical stressapplied to the chip, we confirmed the change of IGBT (Insulated Gate Bipolar Transistor) characteristics by bending test using a PCB (Printed Circuit Board) substrate to which an IGBT chip was mounted. The critical stress under which IGBT chip would fail was calculated by mechanical stress simulation, and the corresponding bending deformation was then applied to the PCB board and the characteristics of the IGBT chip has been investigated. Specifically gate capacitance has decreased after critical tensile stress loaded. By considering the stress direction of the each bending test and the structure of the IGBT chip, some hypothesis that can explain the mechanism of the characteristics change was suggested. As the next step, this hypothesis will be tested and the research regarding this chip characteristics change will be continued.

   Study of Current Ripple Generators for Accelerated Ageing of Capacitors
By Robert KEILMANN [View]
[Download]

Abstract: Upcoming developments in aerospace power applications demand the use of WBG semiconductors.They offer higher switching frequencies resulting in high-frequency ripple currents in the DC-link. Thesecurrents may lead to excessive stress on the DC-link capacitors. This paper proposes a modular ripplecurrent generator for the accelerated ageing of capacitors using high-frequency ripple currents.

   System Level Simulation of Moisture Propagation and Effects in Wind Power Converters
By Johannes Christian WENZEL [View]
[Download]

Abstract: The aim of the present work is to create a better understanding of the propagation of moisture and theireffects in inverter applications with the help of computer-aided simulations. Due to the interaction of humidity and temperature, a combination of multiple simulation models is required. Suitable measurement methods for validation will also be presented.

   Transient Liquid Phase Bond Reliability Evaluation of Die-attach for Power Module Packaging
By Laxma Reddy BILLA [View]
[Download]

Abstract: This paper presents the low temperature and pressure-less Sn-Cu solder technology process by means of Transient Liquid Phase (TLP) diffusion phenomena for high temperature power module packaging. The Sn-Cu diffusion process is developed for bonding a large area dies and its reliability are evaluated by the bond strength and accelerated active and passive thermal cycling tests.

EPE 2022 - DS1d: Reliability & Life-Time
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2022 ECCE Europe - Conference > EPE 2022 - Topic 01: Devices, Packaging and System Integration > EPE 2022 - DS1d: Reliability & Life-Time
	[return to parent folder]

	Comparative Lifetime Estimations for IGBT Modules in Wind Turbine Converters By Christian NEUMANN	[View] [Download]
Abstract: Comparative IGBT lifetime estimations for a generic wind turbine are presented. A thermal impedancematrix is utilized for thermal modeling, addressing thermal cross-coupling effects within the IGBTmodules. For the estimation procedure, all temperature swings are calculated with a high temporalresolution, allowing the correct superposition of each swing.

	Comparison of Power Cycling Results of discrete GaN Cascodes for Automotive Power Electronics with high Temperature Swings By Florian LIPPOLD	[View] [Download]
Abstract: High voltage rated GaN HEMTs are attractive for automotive applications such as on-board charger orauxiliary power supplies. Nowadays GaN is packaged as single chips in discrete housings. In this papera power cycling set up and results for GaN components in discrete TO-247 package are presented.

	Design of a High-Dynamic Test Bench for Accelerated Dielectric LifetimeTesting with adjustable Voltage Slopes and Temperatures By Hendrik SCHEFER	[View] [Download]
Abstract: Upcoming future mobility will require high power densities; therefore, wide bandgap semiconductors(WBGs) and HVDC supply voltage could be one solution. One crucial design criterion is the insulationcoordination in all drive train components. This paper presents and discusses a test bench design toemulate dielectric stress due to fast switching and hard switching WBGs at high voltages and variousenvironmental conditions.

	Dynamic Load Emulation for Automotive Power IC Robustness Validation By Alexander ULBING	[View] [Download]
Abstract: This paper addresses the gap in application related stress testing for automotive power IC qualifications as well as for development-related testing to make ICs more robust. To make test systems more efficient and reduce the cost per test slot the concept of dynamic load emulation has been evaluated. An approach taken by industrial power converters has been adapted to fit the needs of the low power automotive drive domain. To prove the concept and show how application relevant stress could be applied to the device under test simulations are done. In a further step a dedicated hardware test bench has been created and the applicability of the concept within the automotive domain was verified. Several measurements are shown to demonstrate the functionality as well as possible improvements and next steps are discussed.

	Extension and Implementation of a Model-based Lifetime Monitoring System with Parallel Calculation of Multiple Power Semiconductors By Steffen MENZEL	[View] [Download]
Abstract: The importance of power electronics for future energy supply is steadily increasing. This implies a lot of semiconductor-based power converters and thus, a huge number of power semiconductors. Their operational availability becomes a critical feature of the power converters. Therefore, predictable maintenance is a key element for a stable and reliable energy supply. A new approach for a FPGA based implementation of a lifetime model for parallel monitoring of semiconductors will be presented.

	Impact of Bond Wire Configuration on the Power Cycling Capability of Discrete SiC-MOSFET Devices By Patrick HEIMLER	[View] [Download]
Abstract: This work investigates the power cycling capability of SiC MOSFETs (60 mO/1200 V) in TO-247-packages with two different bonding configurations. As a result, a difference in lifetime by a factor of1.5 to 2 is determined. The failure mode was an increase in forward voltage drop by degradation of thebond wire connection. The ANSYS simulations (thermal-electrical and mechanical) confirm thatseveral thinner bond wires have a higher power cycling capability compared to a few bond wires withlarger diameters.

	Investigation of Creepage Distances on Printed Circuit Boards for Avionic Applications By Hendrik SCHEFER	[View] [Download]
Abstract: Avionic power electronic applications need enormous power densities (10 kW/kg inf.) under high reliability to enable a high level of electrification. An increase in the DC bus voltage and high switching frequencies due to WBGs is unavoidable. An improved level of integration of these WBGs is needed to meet the aviation specific requirements regarding weight. Thus, this paper focuses on determining the breakdown voltage induced by DC voltages on printed circuit boards to show new design possibilities for future.

	Magnetic Core Evaluation Kit for the Comparison of Core Losses By Wilmar MARTINEZ	[View] [Download]
Abstract: Within an initiative of different scientific and industrial partners, a comparison of measurement, analytical, and numerical methods for core losses is conducted. Consequently, a core evaluation kit was developed and used in different parts of the world to evaluate the effects of size, shapes, and measurement practices on the core loss models that we use for power conversions systems. In this paper, the fluxometric fpur-wire characterization method was used to characterize ferrite and nanocrystalline materials using different sizes, flux densities, supply voltages, and switching frequencies. It was found that using the same magnetic material, magnetic components have different iron loss properties when the size of the core is changed. These results are the very first of many procedures and tests with this initiative of the magnetic core evaluation kit. And it is expected to contribute to have a common and better understanding of core/iron losses of magnetic components in power electronics.

	Online Junction Temperature Measurement of SiC-MOSFETs via Gate Impedance Using the Gate-Signal Injection Method By David HIRNING	[View] [Download]
Abstract: This paper presents a method for junction temperature monitoring of SiC-MOSFETs based on a high-frequency gate-signal injection. The signal is injected during steady state (e.g. off-state) resulting in a current response, which depends on the temperature dependent gate impedance. The external gate resistor is used as a current shunt to capture the current response. The resulting signal contains the junction temperature information due to the temperature dependency of the gate impedance. This paper focuses on a sinusoidal approach to overcome the challenges due to the temperature dependent parasitic capacitance of the gate circuit. Measurements show the proof of concept, however, there are still challenges to face.

	Powercycling Test Bench with Realistic Loss Distribution and Temperature Ripples By Till-Mathis PLÖTZ	[View] [Download]
Abstract: An innovative test bench is presented, which allows the powercycling for semiconductors under a super-position of temperature ripples with different frequencies. In addition to the implementation of switchinglosses, this creates loadpatterns which are similar to the application. Further, the leakage current of thesemiconductors as a thermo-sensitive parameter is introduced. First results validate the concept.

	Response of IGBT chip characteristics due to critical mechanical stress By Kohei YAMAUCHI	[View] [Download]
Abstract: Focusing on the change in power semiconductor chip characteristics in response to mechanical stressapplied to the chip, we confirmed the change of IGBT (Insulated Gate Bipolar Transistor) characteristics by bending test using a PCB (Printed Circuit Board) substrate to which an IGBT chip was mounted. The critical stress under which IGBT chip would fail was calculated by mechanical stress simulation, and the corresponding bending deformation was then applied to the PCB board and the characteristics of the IGBT chip has been investigated. Specifically gate capacitance has decreased after critical tensile stress loaded. By considering the stress direction of the each bending test and the structure of the IGBT chip, some hypothesis that can explain the mechanism of the characteristics change was suggested. As the next step, this hypothesis will be tested and the research regarding this chip characteristics change will be continued.

	Study of Current Ripple Generators for Accelerated Ageing of Capacitors By Robert KEILMANN	[View] [Download]
Abstract: Upcoming developments in aerospace power applications demand the use of WBG semiconductors.They offer higher switching frequencies resulting in high-frequency ripple currents in the DC-link. Thesecurrents may lead to excessive stress on the DC-link capacitors. This paper proposes a modular ripplecurrent generator for the accelerated ageing of capacitors using high-frequency ripple currents.

	System Level Simulation of Moisture Propagation and Effects in Wind Power Converters By Johannes Christian WENZEL	[View] [Download]
Abstract: The aim of the present work is to create a better understanding of the propagation of moisture and theireffects in inverter applications with the help of computer-aided simulations. Due to the interaction of humidity and temperature, a combination of multiple simulation models is required. Suitable measurement methods for validation will also be presented.

	Transient Liquid Phase Bond Reliability Evaluation of Die-attach for Power Module Packaging By Laxma Reddy BILLA	[View] [Download]
Abstract: This paper presents the low temperature and pressure-less Sn-Cu solder technology process by means of Transient Liquid Phase (TLP) diffusion phenomena for high temperature power module packaging. The Sn-Cu diffusion process is developed for bonding a large area dies and its reliability are evaluated by the bond strength and accelerated active and passive thermal cycling tests.