Powercycling Test Bench with Realistic Loss Distribution and Temperature Ripples | ||||||
Author(s) | Till-Mathis PLĂ–TZ | |||||
Abstract | An innovative test bench is presented, which allows the powercycling for semiconductors under a super-position of temperature ripples with different frequencies. In addition to the implementation of switchinglosses, this creates loadpatterns which are similar to the application. Further, the leakage current of thesemiconductors as a thermo-sensitive parameter is introduced. First results validate the concept. | |||||
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Type | Members Only | |||||
Date | Last modified 2023-09-24 by System | |||||
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