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   Powercycling Test Bench with Realistic Loss Distribution and Temperature Ripples   [View] 
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 Author(s)   Till-Mathis PLĂ–TZ 
 Abstract   An innovative test bench is presented, which allows the powercycling for semiconductors under a super-position of temperature ripples with different frequencies. In addition to the implementation of switchinglosses, this creates loadpatterns which are similar to the application. Further, the leakage current of thesemiconductors as a thermo-sensitive parameter is introduced. First results validate the concept. 
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Filename:0146-epe2022-full-14243250.pdf
Filesize:3.13 MB
 Type   Members Only 
 Date   Last modified 2023-09-24 by System