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Transient Liquid Phase Bond Reliability Evaluation of Die-attach for Power Module Packaging
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| Author(s) |
Laxma Reddy BILLA |
| Abstract |
This paper presents the low temperature and pressure-less Sn-Cu solder technology process by means of Transient Liquid Phase (TLP) diffusion phenomena for high temperature power module packaging. The Sn-Cu diffusion process is developed for bonding a large area dies and its reliability are evaluated by the bond strength and accelerated active and passive thermal cycling tests. |
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| Filename: | 0327-epe2022-full-10390646.pdf |
| Filesize: | 697.8 KB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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