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 EPE 2014 - Topic 01: Devices, Packaging and System Integration 
 You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2014 ECCE Europe - Conference > EPE 2014 - Topic 01: Devices, Packaging and System Integration 
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   EPE 2014 - DS2a: Active Components   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Active Components
   EPE 2014 - DS2b: New Materials and Active Devices   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session New Materials and Active Devices
   EPE 2014 - DS2c: Power System Integration, Packaging Thermal Management   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Power System Integration, Packaging Thermal Management
   EPE 2014 - DS3a: Passive Components   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Passive Components
   EPE 2014 - DS3b: Reliability   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Reliability
   EPE 2014 - LS3b: Packaging and System Integration   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Packaging and System Integration
   EPE 2014 - LS4b: Wide Band gap devices   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Wide Band gap devices
   EPE 2014 - LS5b: Reliability   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session Reliability
   EPE 2014 - LS6b: IGBTs   
In this category, you will find the papers presented at the EPE '14 ECCE Europe Conference during the session IGBTs