EPE Association: EPE 2014 - DS2c: Power System Integration, Packaging Thermal Management

EPE 2014 - DS2c: Power System Integration, Packaging Thermal Management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2014 ECCE Europe - Conference > EPE 2014 - Topic 01: Devices, Packaging and System Integration > EPE 2014 - DS2c: Power System Integration, Packaging Thermal Management

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   A New Generation of Modular Power Inductors with Minimum Thermal Resistance
By Alexander STADLER, Tobias STOLZKE, Christof GULDEN [View]
[Download]

Abstract: Improving power density is a permanent challenge of RD in power electronics. A survey of modern power electronic circuits shows that further optimization has to be based on the passives and particularly on the inductive components. State of the art inductors (e.g. in LC/LCL filters) contribute a lot to space, weight, losses and cost as well. In this paper, a new generation of power inductors is presented. The thermal management of these components has been optimized using FEM and extensive thermal measurements. Thus, much higher electrical current densities have become possible at the same hot-spot temperature, which is finally equivalent to higher energy density and smaller component size.

   High current density air cored Inductors for direct power module integration
By Rasha SAEED, C. Mark JOHNSON, Lee EMPRINGHAM, Liliana DE LILLO [View]
[Download]

Abstract: This paper presents an investigation into the integration of high current density inductors into a double side cooled sandwich power module package from the perspective of thermal management of the integrated inductors. The advantage of using this integration method with regards to using the converter thermal management system will be discussed in order to create a high speed optimised commutation circuit. The main aim is to allow the use of a high current density and hence obtain a high power density and high energy storage.

   Low Cost Integrated Motor-Controller Drive for an Electrical Active Suspension System
By Aris GKOUNTARAS, Christian DINCA, Artur GIEDYMIN, Paul BIRGEL, UWE SCHAEFER, Sibylle DIECKERHOFF [View]
[Download]

Abstract: This paper presents an electrical drive designed for an electrical active suspension system with motor,pump wheel and power electronics integrated in the same housing, sharing the same cooling method.The proposed drive is designed for the new 48V automotive standard for auxiliary drives having a maximum load of 2.5kW. The necessary mechanical and electrical requirements for the complete drive aredocumented. Design guidelines are presented for the integrated power electronics and motor drive andverified through experimental results. Transient thermal simulations are conducted to support the thermaldesign of the system.

   New Monolithic Multi-pole Converter Device for Medium Power Applications
By Abdelilah EL KHADIRY, Abdelhakim BOURENNANE, Frédéric RICHARDEAU, ADEM LALE, Samuel CHARLOT [View]
[Download]

Abstract: This paper presents a monolithic integration approach of a generic power converter (DC/AC or AC/DC). The integration approach is verified for the case of an H-bridge inverter application through 2D simulations. Experimental characterization results are provided for the common anode three-pole chip and for RC-IGBT structures. The aim of this integration approach is to suppress wire bonds and to have ultra-compact package in order to improve electrical performance as well as reliability of the power modules in medium power applications.

   Online Junction Temperature Measurement via Internal Gate Resistance during Turn-On
By Nick BAKER [View]
[Download]

Abstract: A new method for junction temperature measurement of power semiconductor switches is presented. The method consists of integrating the gate voltage of an IGBT or MOSFET during the turn-on or turn-off delay, which in turn produces an output measurement voltage that fluctuates due to the temperature dependent resistance of the temperature sensitive electrical parameter (TSEP): the internal gate resistance. The measurement circuit can be integrated into a gate driver with no modification to converter or gate driver operation and holds significant advantages over other TSEP based measurement methods, primarily being: an absence of any dependence on operating conditions such as load current, and the potential to achieve higher sensitivity (20mV/C or more) than alternative other TSEPs. The measurement circuit is successfully implemented in a double pulse test and is able to produce a measurement voltage dependent on the junction temperature of an IGBT module.

   Round busbar concept for 30 nH, 1.7 kV, 10 kA IGBT non-destructive short-circuit tester
By Liudmila SMIRNOVA, Francesco IANNUZZO, Rui WU, Frede BLAABJERG, Juha PYRHÖNEN [View]
[Download]

Abstract: Design of a Non-Destructive Test (NDT) set-up for short-circuit tests of 1.7 kV, 1 kA IGBT modules is discussed in this paper. The test set-up allows achieving short-circuit current up to 10 kA. The important objective during the design of the test set-up is to minimize the parasitic inductance and assure equal current sharing among the parallel connected devices. Achieving of a low inductance level is very challenging due to the current and voltage ratings, the presence of series and parallel protection systems and the required access for a thermal camera. The parasitic extractor Ansys Q3D is used to estimate the parasitic inductances during the design. A new concept of round-shaped, low inductive busbars for an NDT set-up is proposed. Simulation results verified that both reduction of overall inductance and good uniformity in current sharing among parallel devices are achieved by utilizing a circular symmetry. Experimental validation of the simulation was performed using a preliminary set-up. Further, this concept can be implemented in the design of the busbars for the power converters, where the parallel connection of the switching devices is applied to obtain higher current levels.

   THERMAL MANAGEMENT FOR A LOW-COST 2KW SOLAR INVERTER
By Guillaume LEFEVRE, Nicolas DEGRENNE, Stefan MOLLOV [View]
[Download]

Abstract: This paper presents a cost-optimized thermal solution for a 2kW solar inverter. It relies on a naturalconvection and through-PCB thermal strategy to increase reliability and reduce cost. A methodology isdescribed to optimize the heat-sink, as well as thermal interfaces, with the analytical approachconfirmed by finite element analysis. An experimental set-up is used to validate the methodology.

EPE 2014 - DS2c: Power System Integration, Packaging Thermal Management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2014 ECCE Europe - Conference > EPE 2014 - Topic 01: Devices, Packaging and System Integration > EPE 2014 - DS2c: Power System Integration, Packaging Thermal Management
	[return to parent folder]

	A New Generation of Modular Power Inductors with Minimum Thermal Resistance By Alexander STADLER, Tobias STOLZKE, Christof GULDEN	[View] [Download]
Abstract: Improving power density is a permanent challenge of RD in power electronics. A survey of modern power electronic circuits shows that further optimization has to be based on the passives and particularly on the inductive components. State of the art inductors (e.g. in LC/LCL filters) contribute a lot to space, weight, losses and cost as well. In this paper, a new generation of power inductors is presented. The thermal management of these components has been optimized using FEM and extensive thermal measurements. Thus, much higher electrical current densities have become possible at the same hot-spot temperature, which is finally equivalent to higher energy density and smaller component size.

	High current density air cored Inductors for direct power module integration By Rasha SAEED, C. Mark JOHNSON, Lee EMPRINGHAM, Liliana DE LILLO	[View] [Download]
Abstract: This paper presents an investigation into the integration of high current density inductors into a double side cooled sandwich power module package from the perspective of thermal management of the integrated inductors. The advantage of using this integration method with regards to using the converter thermal management system will be discussed in order to create a high speed optimised commutation circuit. The main aim is to allow the use of a high current density and hence obtain a high power density and high energy storage.

	Low Cost Integrated Motor-Controller Drive for an Electrical Active Suspension System By Aris GKOUNTARAS, Christian DINCA, Artur GIEDYMIN, Paul BIRGEL, UWE SCHAEFER, Sibylle DIECKERHOFF	[View] [Download]
Abstract: This paper presents an electrical drive designed for an electrical active suspension system with motor,pump wheel and power electronics integrated in the same housing, sharing the same cooling method.The proposed drive is designed for the new 48V automotive standard for auxiliary drives having a maximum load of 2.5kW. The necessary mechanical and electrical requirements for the complete drive aredocumented. Design guidelines are presented for the integrated power electronics and motor drive andverified through experimental results. Transient thermal simulations are conducted to support the thermaldesign of the system.

	New Monolithic Multi-pole Converter Device for Medium Power Applications By Abdelilah EL KHADIRY, Abdelhakim BOURENNANE, Frédéric RICHARDEAU, ADEM LALE, Samuel CHARLOT	[View] [Download]
Abstract: This paper presents a monolithic integration approach of a generic power converter (DC/AC or AC/DC). The integration approach is verified for the case of an H-bridge inverter application through 2D simulations. Experimental characterization results are provided for the common anode three-pole chip and for RC-IGBT structures. The aim of this integration approach is to suppress wire bonds and to have ultra-compact package in order to improve electrical performance as well as reliability of the power modules in medium power applications.

	Online Junction Temperature Measurement via Internal Gate Resistance during Turn-On By Nick BAKER	[View] [Download]
Abstract: A new method for junction temperature measurement of power semiconductor switches is presented. The method consists of integrating the gate voltage of an IGBT or MOSFET during the turn-on or turn-off delay, which in turn produces an output measurement voltage that fluctuates due to the temperature dependent resistance of the temperature sensitive electrical parameter (TSEP): the internal gate resistance. The measurement circuit can be integrated into a gate driver with no modification to converter or gate driver operation and holds significant advantages over other TSEP based measurement methods, primarily being: an absence of any dependence on operating conditions such as load current, and the potential to achieve higher sensitivity (20mV/C or more) than alternative other TSEPs. The measurement circuit is successfully implemented in a double pulse test and is able to produce a measurement voltage dependent on the junction temperature of an IGBT module.

	Round busbar concept for 30 nH, 1.7 kV, 10 kA IGBT non-destructive short-circuit tester By Liudmila SMIRNOVA, Francesco IANNUZZO, Rui WU, Frede BLAABJERG, Juha PYRHÖNEN	[View] [Download]
Abstract: Design of a Non-Destructive Test (NDT) set-up for short-circuit tests of 1.7 kV, 1 kA IGBT modules is discussed in this paper. The test set-up allows achieving short-circuit current up to 10 kA. The important objective during the design of the test set-up is to minimize the parasitic inductance and assure equal current sharing among the parallel connected devices. Achieving of a low inductance level is very challenging due to the current and voltage ratings, the presence of series and parallel protection systems and the required access for a thermal camera. The parasitic extractor Ansys Q3D is used to estimate the parasitic inductances during the design. A new concept of round-shaped, low inductive busbars for an NDT set-up is proposed. Simulation results verified that both reduction of overall inductance and good uniformity in current sharing among parallel devices are achieved by utilizing a circular symmetry. Experimental validation of the simulation was performed using a preliminary set-up. Further, this concept can be implemented in the design of the busbars for the power converters, where the parallel connection of the switching devices is applied to obtain higher current levels.

	THERMAL MANAGEMENT FOR A LOW-COST 2KW SOLAR INVERTER By Guillaume LEFEVRE, Nicolas DEGRENNE, Stefan MOLLOV	[View] [Download]
Abstract: This paper presents a cost-optimized thermal solution for a 2kW solar inverter. It relies on a naturalconvection and through-PCB thermal strategy to increase reliability and reduce cost. A methodology isdescribed to optimize the heat-sink, as well as thermal interfaces, with the analytical approachconfirmed by finite element analysis. An experimental set-up is used to validate the methodology.