| EPE 2025 - Topic 07: Semiconductor Devices and Packaging |
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 | EPE 2025 - DS1k: Active Devices and Components |
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| In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Active Devices and Components |
| | EPE 2025 - DS1l: Integration and Packaging |
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| In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Integration and Packaging |
| | EPE 2025 - DS1m: Cooling Circuits and Thermal Management |
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| In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Cooling Circuits and Thermal Management |
| | EPE 2025 - DS1n: Reliability and Life-Cycle Assessment |
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| In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Reliability and Life-Cycle Assessment |
| | EPE 2025 - LS1d: Active devices |
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| In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Active devices |
| | EPE 2025 - LS2d: Reliability & Systems & Packaging |
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| In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Reliability & Systems & Packaging |