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 EPE 2019 - Topic 01: Devices, Packaging and System Integration 
 You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2019 ECCE Europe - Conference > EPE 2019 - Topic 01: Devices, Packaging and System Integration 
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   EPE 2019 - DS1a: Passive Components   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Passive Components
   EPE 2019 - DS1b: Active Devices and Components (Wide Bandgap and Other New Materials)   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Active Devices and Components (Wide Bandgap and Other New Materials)
   EPE 2019 - DS2a: Active Devices and Components (Si)   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Active Devices and Components (Si)
   EPE 2019 - DS2b: System Integration, Packaging & Thermal Management   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session System Integration, Packaging & Thermal Management
   EPE 2019 - DS2c: Reliability   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Reliability
   EPE 2019 - LS1a: Wide Bandgap Devices   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Wide Bandgap Devices
   EPE 2019 - LS2a: Silicon Power Devices   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Silicon Power Devices
   EPE 2019 - LS3a: Reliability   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Reliability
   EPE 2019 - LS4a: Passives   
In this category, you will find the papers presented at the EPE '19 ECCE Europe Conference during the session Passives