EPE Association: EPE 2011 - DS3a: Topic 02: Passive Components, System Integration & Packaging

EPE 2011 - DS3a: Topic 02: Passive Components, System Integration & Packaging
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2011 ECCE Europe - Conference > EPE 2011 - Topic 02: Passive Components, System Integration & Packaging > EPE 2011 - DS3a: Topic 02: Passive Components, System Integration & Packaging

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   3D integration of a three-phase bi-directional power switch
By Kassa Adane SOLOMON, Alberto CASTELLAZZI, Andrew TRENTIN [View]
[Download]

Abstract: This paper presents a high power density vertical integration scheme for bi-directional power switches. In this original approach, the power semiconductor devices are stacked in pairs, but are both connected with their backside to the cooling plane. Thus, double sided cooling is ensured, while power density and parasitic inductance values are improved as compared to previous approaches. In particular, this work considers a full 3-phase bi-directional switch, of the kind required, for instance, to implement a 3-to-1-phase matrix converter.

   A Coffin-Manson Model to Predict TRIAC Solder Joints Fatigue during Power Cycling
By Sebastien JACQUES, Adelphe CALDEIRA, Nathalie BATUT, Ambroise SCHELLMANNS, René LEROY, Laurent GONTHIER [View]
[Download]

Abstract: In this paper, a physical model is proposed to estimate the TRIAC solder joints fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (Delta(Tcase)) is the main acceleration factor, the solder joints are the weakest materials in the TRIAC assembly, and the plastic strain within the solder layer due to shearing is the failure cause.

   Air-Cooling Optimization at System Level
By Thomas GRADINGER [View]
[Download]

Abstract: A computational model and a method is presented for the optimization of air cooling for power electronics in terms of thermal performance, cooling-system size and acoustic noise, which are key parameters for power-electronic applications. A number of case studies is performed, showing the relationship and the trade-offs between these quantities.In general increasing thermal performance leads to bigger size and/or higher noise, while lowering noise for constant thermal performance increases size. Within the basic physical limits, optimization is possible, which must be carried out at system level, as the results cannot be found by separately optimizing individual cooling-system components. Examples are the enlargement of the heat sink or the addition of volume for porous duct lining, which both can lead to a smaller overall system for fixed thermal performance and noise. Furthermore it can be said that any measure to reduce pressure drop, such as the introduction of guiding vanes in a bend, reduces size and/or noise at fixed thermal performance. The results are shown to be in accordance with theoretical scaling laws, relating thermal resistance, size and sound pressure.The trade-off between thermal performance, size and noise worked out for air-cooling systems is expected to be of general nature, applying to any kind of cooling system. In future work, the present method could be used to compare air cooling with other types of cooling systems, in particular water cooling and two-phase cooling.

   Current Distribution in Copper Coils with Parallel Windings
By Anne-Christine LEICHT, Matthias SPANG, Daniel KUEBRICH, Manfred ALBACH [View]
[Download]

Abstract: The assumption of equal current distribution in parallel windings of coils may lead to a wrong lossprediction. An analytical calculation of the current sharing, which is based on both the frequencydependent resistances of the parallel windings and on the magnetic coupling between these windings,is introduced and verified by measurements.

   Current Distribution in High Power Laminated Busbars
By Angus BRYANT, Kiran Kumar VADLAPATI, Jonathan STARKEY, Andy GOLDNEY, Stefanos KANDILIDIS, David HINCHLEY [View]
[Download]

Abstract: The new LV8900 900 V variable speed drive range from Converteam utilises 3-level NPC invertertopology, featuring multi-layer laminated busbars. These laminates contribute to the commutating stray inductances, and laminate resistive losses in high current and high switching frequency applications are affected by the skin effect. This paper describes models implemented in FastHenryand Simulink accounting for these effects in the laminates as part of the design process. The results show close matching to experimentally measured laminate losses and correct prediction of stray inductance behaviour.

   Design and Analysis of a Bus Bar Structure for a Medium Voltage Inverter
By Masato ANDO, Keiji WADA, Kazuto TAKAO, Takeo KANAI, Shinichi NISHIZAWA, Hiromichi OHASHI [View]
[Download]

Abstract: In order to suppress overvoltage of power devices and noise voltages of inverters, it is essential to analyze the DC-side inductance of the inverter. This paper presents a design procedure of an optimumstructure for a 10-kV, 400-kVA three-level inverter. Rather than using 3D-FEM software, the bus barinductance for the medium voltage inverter is calculated based on a partial inductance method. An inductance map is useful for determining the relationship between the bus bar structure and the inductancevalue and for designing the low-inductance structure. In addition, the calculation results of the bus barinductance correspond to the measurement results, confirming the validity of the proposed method.

   Design and characterization of planar integrated passive component for power converters
By Saijun MAO [View]
[Download]

Abstract: This paper proposes the planar passive components integration technology for power converters to investigate the technology feasibility. The planar passive components integration technology with the advantage of component amounts reduction, compact volume, better thermal management, high reliability and potential cost saving is an enabling platform technology for power converters miniaturization. It is introduced to combine inductor (L), capacitor(C) and transformer (T) into a single integrated passive component (L-C-T) to replace the discrete passive components. The manufacture process is fully compatible with PCB process by using embedded capacitor materials. Innovative integration structures with magnetic flux decoupling for planar integrated L-C-T component are proposed. Electromagnetic modeling method with higher accuracy has been developed to predict integrated L-C-T component parameters and electromagnetic field distribution. The prototype of integrated L-C-T component has been tested with promising performance. Planar passive components integration technology application outlook is presented finally.

   Development of ageing models of capacitors for application to lifetime simulation and state of health monitoring
By Gregor MASSIOT [View]
[Download]

Abstract: No abstract provided.

   Diffusion Soldering for Automotive Power MOSFETs offers the first 100\% leadfree die attach
By Marco PUERSCHEL, Klaus ROESCHLAU [View]
[Download]

Abstract: Every year, end of life vehicles generate between 8 and 9 million tons of waste. In the paper the first automotive released lead free power MOSFET with diffusion soldering die attach in a TO package will be introduced.

   Effect of material technologies on equivalent structural parasitic capacitance of high-voltage cascade rectifier
By Jianing WANG, Peter LUERKENS, Sjoerd DE HAAN, Martin VERWEIJ, Bram FERREIRA [View]
[Download]

Abstract: Progress in material technology in wide-bandgap semiconductors, such as Silicon Carbide (SiC) enables increasing the operation frequency of high-voltage (HV) generators and using less series connected devices for the same voltage rating of the HV-generators, e.g. for x-ray applications. These generators are frequently equipped with HV multipliers, such as the Cockcroft-Walton cascade, a resonant inverter and a high voltage transformer. Power conversion at high frequency usually helps reducing the system size and cost and allows better efficiency at smaller size and lower weight. At high frequency and high voltage, however, the influence of parasitic effects of the multiplier, namely parasitic capacitance, becomes highly relevant to the feeding circuit. Experience from existing circuits indicates, that the total parasitic capacitance at secondary side is not only related to the HV transformer and the junction capacitance of the diodes, but also to the extension of the electric AC field in the rectifier circuit, which reflects the structural parasitic capacitance. It can happen that a substantial amount of driving current is required only for inverting the voltage across the parasitic capacitance, which puts a limit on the maximum useful frequency. In general it is to be expected that parasitic capacitance will increase with denser packaging of the components. In this paper an approach for the determination of the equivalent structural parasitic capacitance is given that is based on a 3D finite element (FE) analysis of the energy in the electric AC fields in the cascade circuit. The method is subsequently used to investigate effect of material technologies on the equivalent structural parasitical capacitance. These investigated technologies are: 1) the effect of the increased blocking voltage and associated reduced number of series connected devices, 2) the effect of the permittivity of isolating media and 3) the effect of a grounded box around the rectifier. The capacitance obtained by field simulation is validated by small signal measurements.

   Gatecard Reliability Prediction Analysis
By Sowmya SOMESHA, Sean LODDICK, David LEE [View]
[Download]

Abstract: The theoretical reliability of Printed Circuit Boards (PCBs) has been compared to actual failure rates, and used to demonstrate the improved accuracy of the parts stress over the simpler parts count approach. The methodology is then extended to demonstrate an expected reliability improvement of Active Stator drives versus equivalent voltage source drives.

   Half-Bridge Power Device Gate Driver Circuit with Isolation using Integrated Magnetic Component and Carrier Signal Phase Switching
By Neville MCNEILL, Derrick HOLLIDAY, Philip MELLOR [View]
[Download]

Abstract: The number of transformers needed in isolated power semiconductor device gate driver circuits can be reduced by using a phase-switched carrier signal technique. This is combined with integrated magnetic techniques to further reduce the number of isolation elements required. A circuit is presented which uses only a single magnetic component to drive both the power semiconductor devices in a bridge leg circuit. Each device is provided with a local floating power supply and can be driven at any duty factor between 0\% and 100\%. Experimental waveforms are given and implementation is discussed.

   Impact of Solder Fatigue on Module Lifetime in Power Cycling Tests
By Uwe SCHEUERMANN, Ralf SCHMIDT [View]
[Download]

Abstract: Different end-of-life mechanisms in power modules (i.e., solder fatigue and wire bond failures) and their interactions are subject of investigation. Their contribution to the lifetime limit is especially relevant for the extrapolation of accelerated endurance test results to application conditions. The comparison of Ag-diffusion sintered modules with traditional soldered modules allows investigating the influence of solder fatigue on the lifetime of power modules under active power cycling.

   Impact of source metallization ageing on thermo-mechanical characteristics of a vertical power device
By Emmanuel MARCAULT, Marie BREIL, Abdelhakim BOURENNANE, Patrick TOUNSI, Donatien MARTINEAU, Philippe DUPUY [View]
[Download]

Abstract: Reliability is a major economic and technical challenge for power electronics. This paper aims at exploring the impact of reconstruction of source metallization [1] due to ageing on temperature and mechanical strain distributions within a smart power device. Based on 3D FEM electro-thermal simulations, we explore thermal and mechanical impact of source metallization ageing on bonding wires during operation.

   Improved Thermal Design of a High Frequency Power Transformer
By Alexander STADLER, Christof GULDEN [View]
[Download]

Abstract: In this paper the thermal management of a high frequency power transformer is investigated. To begin with, it is shown how the total power loss of such a device can be easily predicted. Based on the results, the temperature distribution inside the transformer is simulated. It is demonstrated how different cooling conditions affect the hot-spot temperature. Copper coil formers to improve the thermal connection between coil/core and the bottom plate of the transformer are presented. Further, the effect of insulation material with improved thermal conductivity is investigated. Different transformer prototypes were realized to illustrate the practical capability of the applied thermal model. All simulation is based on finite element method (FEM) and verified by means of experimental data drawn from various electrical and thermal measurements.

   Lifetime calculation for power modules, application and theory of models and counting methods
By Krzysztof MAINKA, Markus THOBEN, Oliver SCHILLING [View]
[Download]

Abstract: Accurate lifetime prediction of power IGBT modules based on realistic mission profile is an important issue for power electronics systems that are used in application with high lifetime requirements. An essential challenge of the process is to determine the correct number of thermal cycles. Various counting methods are applied to extract amplitude, duration and number of thermal cycles from a mission profile. The objective of this paper is to compare different cycle counting algorithms and suggest the correct one for lifetime calculation of IGBT power modules based on the thermo-mechanical FEM analysis.

   Liquid Cooling methods for power electronics in an automotive environment
By Mathias BAUMANN, Wolfgang WONDRAK, Josef LUTZ [View]
[Download]

Abstract: This work compares the performance of “Liquid Pin” coolers and other advanced cooling techniques like “ShowerPower”, pin fin and microchannel. Water glycol mixture (40\% v/v glycol) is used as a cooling agent at temperatures of 5 °C, 20 °C, 40 °C and 60 °C. Various characteristics of the coolers like pressure drop, thermal resistance and impedance are examined.

   Planar layer permeability measurement setup
By Christoph LOEF, Eberhard WAFFENSCHMIDT, Rik W. DE DONCKER [View]
[Download]

Abstract: The permeability of magnetic materials determines the inductance value of chokes and transformers. Upon introducing new materials, the permeability ur of the magnetic material has to be determined. Up to now, the permeability has been determined using an Epstein frame. However, if a planar shape of a magnetic core is under investigation, the mentioned measurement set-up is not applicable. The aim of this paper is present a new method to determine the permeability of planar shaped magnetic cores used in printed circuit boards integrated planar coils.Here, reference simulations were combined with measurements, whereby all results where in good agreement.. In conclusion, this newly presented setup is easy to construct and can be universally applied to determine the permeability of e.g. ferrite polymer compound cores.

EPE 2011 - DS3a: Topic 02: Passive Components, System Integration & Packaging
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2011 ECCE Europe - Conference > EPE 2011 - Topic 02: Passive Components, System Integration & Packaging > EPE 2011 - DS3a: Topic 02: Passive Components, System Integration & Packaging
	[return to parent folder]

	3D integration of a three-phase bi-directional power switch By Kassa Adane SOLOMON, Alberto CASTELLAZZI, Andrew TRENTIN	[View] [Download]
Abstract: This paper presents a high power density vertical integration scheme for bi-directional power switches. In this original approach, the power semiconductor devices are stacked in pairs, but are both connected with their backside to the cooling plane. Thus, double sided cooling is ensured, while power density and parasitic inductance values are improved as compared to previous approaches. In particular, this work considers a full 3-phase bi-directional switch, of the kind required, for instance, to implement a 3-to-1-phase matrix converter.

	A Coffin-Manson Model to Predict TRIAC Solder Joints Fatigue during Power Cycling By Sebastien JACQUES, Adelphe CALDEIRA, Nathalie BATUT, Ambroise SCHELLMANNS, René LEROY, Laurent GONTHIER	[View] [Download]
Abstract: In this paper, a physical model is proposed to estimate the TRIAC solder joints fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (Delta(Tcase)) is the main acceleration factor, the solder joints are the weakest materials in the TRIAC assembly, and the plastic strain within the solder layer due to shearing is the failure cause.

	Air-Cooling Optimization at System Level By Thomas GRADINGER	[View] [Download]
Abstract: A computational model and a method is presented for the optimization of air cooling for power electronics in terms of thermal performance, cooling-system size and acoustic noise, which are key parameters for power-electronic applications. A number of case studies is performed, showing the relationship and the trade-offs between these quantities.In general increasing thermal performance leads to bigger size and/or higher noise, while lowering noise for constant thermal performance increases size. Within the basic physical limits, optimization is possible, which must be carried out at system level, as the results cannot be found by separately optimizing individual cooling-system components. Examples are the enlargement of the heat sink or the addition of volume for porous duct lining, which both can lead to a smaller overall system for fixed thermal performance and noise. Furthermore it can be said that any measure to reduce pressure drop, such as the introduction of guiding vanes in a bend, reduces size and/or noise at fixed thermal performance. The results are shown to be in accordance with theoretical scaling laws, relating thermal resistance, size and sound pressure.The trade-off between thermal performance, size and noise worked out for air-cooling systems is expected to be of general nature, applying to any kind of cooling system. In future work, the present method could be used to compare air cooling with other types of cooling systems, in particular water cooling and two-phase cooling.

	Current Distribution in Copper Coils with Parallel Windings By Anne-Christine LEICHT, Matthias SPANG, Daniel KUEBRICH, Manfred ALBACH	[View] [Download]
Abstract: The assumption of equal current distribution in parallel windings of coils may lead to a wrong lossprediction. An analytical calculation of the current sharing, which is based on both the frequencydependent resistances of the parallel windings and on the magnetic coupling between these windings,is introduced and verified by measurements.

	Current Distribution in High Power Laminated Busbars By Angus BRYANT, Kiran Kumar VADLAPATI, Jonathan STARKEY, Andy GOLDNEY, Stefanos KANDILIDIS, David HINCHLEY	[View] [Download]
Abstract: The new LV8900 900 V variable speed drive range from Converteam utilises 3-level NPC invertertopology, featuring multi-layer laminated busbars. These laminates contribute to the commutating stray inductances, and laminate resistive losses in high current and high switching frequency applications are affected by the skin effect. This paper describes models implemented in FastHenryand Simulink accounting for these effects in the laminates as part of the design process. The results show close matching to experimentally measured laminate losses and correct prediction of stray inductance behaviour.

	Design and Analysis of a Bus Bar Structure for a Medium Voltage Inverter By Masato ANDO, Keiji WADA, Kazuto TAKAO, Takeo KANAI, Shinichi NISHIZAWA, Hiromichi OHASHI	[View] [Download]
Abstract: In order to suppress overvoltage of power devices and noise voltages of inverters, it is essential to analyze the DC-side inductance of the inverter. This paper presents a design procedure of an optimumstructure for a 10-kV, 400-kVA three-level inverter. Rather than using 3D-FEM software, the bus barinductance for the medium voltage inverter is calculated based on a partial inductance method. An inductance map is useful for determining the relationship between the bus bar structure and the inductancevalue and for designing the low-inductance structure. In addition, the calculation results of the bus barinductance correspond to the measurement results, confirming the validity of the proposed method.

	Design and characterization of planar integrated passive component for power converters By Saijun MAO	[View] [Download]
Abstract: This paper proposes the planar passive components integration technology for power converters to investigate the technology feasibility. The planar passive components integration technology with the advantage of component amounts reduction, compact volume, better thermal management, high reliability and potential cost saving is an enabling platform technology for power converters miniaturization. It is introduced to combine inductor (L), capacitor(C) and transformer (T) into a single integrated passive component (L-C-T) to replace the discrete passive components. The manufacture process is fully compatible with PCB process by using embedded capacitor materials. Innovative integration structures with magnetic flux decoupling for planar integrated L-C-T component are proposed. Electromagnetic modeling method with higher accuracy has been developed to predict integrated L-C-T component parameters and electromagnetic field distribution. The prototype of integrated L-C-T component has been tested with promising performance. Planar passive components integration technology application outlook is presented finally.

	Development of ageing models of capacitors for application to lifetime simulation and state of health monitoring By Gregor MASSIOT	[View] [Download]
Abstract: No abstract provided.

	Diffusion Soldering for Automotive Power MOSFETs offers the first 100\% leadfree die attach By Marco PUERSCHEL, Klaus ROESCHLAU	[View] [Download]
Abstract: Every year, end of life vehicles generate between 8 and 9 million tons of waste. In the paper the first automotive released lead free power MOSFET with diffusion soldering die attach in a TO package will be introduced.

	Effect of material technologies on equivalent structural parasitic capacitance of high-voltage cascade rectifier By Jianing WANG, Peter LUERKENS, Sjoerd DE HAAN, Martin VERWEIJ, Bram FERREIRA	[View] [Download]
Abstract: Progress in material technology in wide-bandgap semiconductors, such as Silicon Carbide (SiC) enables increasing the operation frequency of high-voltage (HV) generators and using less series connected devices for the same voltage rating of the HV-generators, e.g. for x-ray applications. These generators are frequently equipped with HV multipliers, such as the Cockcroft-Walton cascade, a resonant inverter and a high voltage transformer. Power conversion at high frequency usually helps reducing the system size and cost and allows better efficiency at smaller size and lower weight. At high frequency and high voltage, however, the influence of parasitic effects of the multiplier, namely parasitic capacitance, becomes highly relevant to the feeding circuit. Experience from existing circuits indicates, that the total parasitic capacitance at secondary side is not only related to the HV transformer and the junction capacitance of the diodes, but also to the extension of the electric AC field in the rectifier circuit, which reflects the structural parasitic capacitance. It can happen that a substantial amount of driving current is required only for inverting the voltage across the parasitic capacitance, which puts a limit on the maximum useful frequency. In general it is to be expected that parasitic capacitance will increase with denser packaging of the components. In this paper an approach for the determination of the equivalent structural parasitic capacitance is given that is based on a 3D finite element (FE) analysis of the energy in the electric AC fields in the cascade circuit. The method is subsequently used to investigate effect of material technologies on the equivalent structural parasitical capacitance. These investigated technologies are: 1) the effect of the increased blocking voltage and associated reduced number of series connected devices, 2) the effect of the permittivity of isolating media and 3) the effect of a grounded box around the rectifier. The capacitance obtained by field simulation is validated by small signal measurements.

	Gatecard Reliability Prediction Analysis By Sowmya SOMESHA, Sean LODDICK, David LEE	[View] [Download]
Abstract: The theoretical reliability of Printed Circuit Boards (PCBs) has been compared to actual failure rates, and used to demonstrate the improved accuracy of the parts stress over the simpler parts count approach. The methodology is then extended to demonstrate an expected reliability improvement of Active Stator drives versus equivalent voltage source drives.

	Half-Bridge Power Device Gate Driver Circuit with Isolation using Integrated Magnetic Component and Carrier Signal Phase Switching By Neville MCNEILL, Derrick HOLLIDAY, Philip MELLOR	[View] [Download]
Abstract: The number of transformers needed in isolated power semiconductor device gate driver circuits can be reduced by using a phase-switched carrier signal technique. This is combined with integrated magnetic techniques to further reduce the number of isolation elements required. A circuit is presented which uses only a single magnetic component to drive both the power semiconductor devices in a bridge leg circuit. Each device is provided with a local floating power supply and can be driven at any duty factor between 0\% and 100\%. Experimental waveforms are given and implementation is discussed.

	Impact of Solder Fatigue on Module Lifetime in Power Cycling Tests By Uwe SCHEUERMANN, Ralf SCHMIDT	[View] [Download]
Abstract: Different end-of-life mechanisms in power modules (i.e., solder fatigue and wire bond failures) and their interactions are subject of investigation. Their contribution to the lifetime limit is especially relevant for the extrapolation of accelerated endurance test results to application conditions. The comparison of Ag-diffusion sintered modules with traditional soldered modules allows investigating the influence of solder fatigue on the lifetime of power modules under active power cycling.

	Impact of source metallization ageing on thermo-mechanical characteristics of a vertical power device By Emmanuel MARCAULT, Marie BREIL, Abdelhakim BOURENNANE, Patrick TOUNSI, Donatien MARTINEAU, Philippe DUPUY	[View] [Download]
Abstract: Reliability is a major economic and technical challenge for power electronics. This paper aims at exploring the impact of reconstruction of source metallization [1] due to ageing on temperature and mechanical strain distributions within a smart power device. Based on 3D FEM electro-thermal simulations, we explore thermal and mechanical impact of source metallization ageing on bonding wires during operation.

	Improved Thermal Design of a High Frequency Power Transformer By Alexander STADLER, Christof GULDEN	[View] [Download]
Abstract: In this paper the thermal management of a high frequency power transformer is investigated. To begin with, it is shown how the total power loss of such a device can be easily predicted. Based on the results, the temperature distribution inside the transformer is simulated. It is demonstrated how different cooling conditions affect the hot-spot temperature. Copper coil formers to improve the thermal connection between coil/core and the bottom plate of the transformer are presented. Further, the effect of insulation material with improved thermal conductivity is investigated. Different transformer prototypes were realized to illustrate the practical capability of the applied thermal model. All simulation is based on finite element method (FEM) and verified by means of experimental data drawn from various electrical and thermal measurements.

	Lifetime calculation for power modules, application and theory of models and counting methods By Krzysztof MAINKA, Markus THOBEN, Oliver SCHILLING	[View] [Download]
Abstract: Accurate lifetime prediction of power IGBT modules based on realistic mission profile is an important issue for power electronics systems that are used in application with high lifetime requirements. An essential challenge of the process is to determine the correct number of thermal cycles. Various counting methods are applied to extract amplitude, duration and number of thermal cycles from a mission profile. The objective of this paper is to compare different cycle counting algorithms and suggest the correct one for lifetime calculation of IGBT power modules based on the thermo-mechanical FEM analysis.

	Liquid Cooling methods for power electronics in an automotive environment By Mathias BAUMANN, Wolfgang WONDRAK, Josef LUTZ	[View] [Download]
Abstract: This work compares the performance of “Liquid Pin” coolers and other advanced cooling techniques like “ShowerPower”, pin fin and microchannel. Water glycol mixture (40\% v/v glycol) is used as a cooling agent at temperatures of 5 °C, 20 °C, 40 °C and 60 °C. Various characteristics of the coolers like pressure drop, thermal resistance and impedance are examined.

	Planar layer permeability measurement setup By Christoph LOEF, Eberhard WAFFENSCHMIDT, Rik W. DE DONCKER	[View] [Download]
Abstract: The permeability of magnetic materials determines the inductance value of chokes and transformers. Upon introducing new materials, the permeability ur of the magnetic material has to be determined. Up to now, the permeability has been determined using an Epstein frame. However, if a planar shape of a magnetic core is under investigation, the mentioned measurement set-up is not applicable. The aim of this paper is present a new method to determine the permeability of planar shaped magnetic cores used in printed circuit boards integrated planar coils.Here, reference simulations were combined with measurements, whereby all results where in good agreement.. In conclusion, this newly presented setup is easy to construct and can be universally applied to determine the permeability of e.g. ferrite polymer compound cores.