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A Coffin-Manson Model to Predict TRIAC Solder Joints Fatigue during Power Cycling
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| Author(s) |
Sebastien JACQUES, Adelphe CALDEIRA, Nathalie BATUT, Ambroise SCHELLMANNS, René LEROY, Laurent GONTHIER |
| Abstract |
In this paper, a physical model is proposed to estimate the TRIAC solder joints fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (Delta(Tcase)) is the main acceleration factor, the solder joints are the weakest materials in the TRIAC assembly, and the plastic strain within the solder layer due to shearing is the failure cause. |
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| Filename: | 0383-epe2011-full-15160138.pdf |
| Filesize: | 133.7 KB |
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| Type |
Members Only |
| Date |
Last modified 2012-01-26 by System |
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