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Diffusion Soldering for Automotive Power MOSFETs offers the first 100\% leadfree die attach
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| Author(s) |
Marco PUERSCHEL, Klaus ROESCHLAU |
| Abstract |
Every year, end of life vehicles generate between 8 and 9 million tons of waste. In the paper the first automotive released lead free power MOSFET with diffusion soldering die attach in a TO package will be introduced. |
| Download |
| Filename: | 0239-epe2011-full-11230778.pdf |
| Filesize: | 251.7 KB |
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| Type |
Members Only |
| Date |
Last modified 2012-01-26 by System |
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