EPE Association: EPE-PEMC 2002: Special Session: Packing and Integration of Power Electronic Converters

EPE-PEMC 2002: Special Session: Packing and Integration of Power Electronic Converters
You are here: EPE Documents > 04 - EPE-PEMC Conference Proceedings > EPE-PEMC 2002 - Conference > EPE-PEMC 2002: Special Session: Packing and Integration of Power Electronic Converters

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   Comparison of spray cooling with direct liquid base-plate flow convection of IGBT power modules
By G. Lefranc; G. Mitic; W. Kiffe; S. Ramminger; D. E. Tilton; B. A. Smetana; T. D. Weir [View]
[Download]

Abstract: Removing the dissipated heat directly from the surface of the chip by means of spray cooling increases the efficiency of cooling and reduces the temperature gradients at the chip surface. Both together lead to a significant increase in the reliability of the whole system. A demonstration system with a eupec BSM 150 IGBT module was built to show the efficiency of spray cooling for high power dissipation in electronic power modules. The maximum power dissipation of the module is rated at 1250 W. IGBTs with heat dissipation of almost 200 W/cm2 were successfully cooled by spray cooling using a Perfluorinated inert liquid (Fluorinert). The transient electrical measurements showed that the thermal resistance between the junction and the ambient was 0.064 K/W in the case of spray cooling in contrast to 0.075 K/W for direct flow convection between water and baseplate.

   High Power Densities with Three Dimensional Integration
By J. A. Ferreira [View]
[Download]

Abstract: A trend exists towards higher power densities in power electronic, driven by the applications market and new technologies.The hybrid integration of semiconductor devices represents the first level of power electronic integration. At higher levels passive components will be included in the same package and eventually complete power electronic converters could be integrated. This calls not only for more compact three dimensional packaging techniques but electromagnetic integration of the passive circuit functions and integrated heat management of all the circuit components. In the paper various issues for achieving high power densities and higher levels of integration are discussed including geometrical packaging, electromagnetic and thermal issues.

   Integrated Multidisciplinary Modeling, Analysis and Design in Power Electronics
By J. Z. Chen; D. Boroyevich [View]
[Download]

Abstract: Due to the nature of electronic power processing, the design of power electronics components, converters and systems has always involved many disciplines: from circuits and solid-state physics, to electromagnetics, systems and control, thermodynamics, structural mechanics, material science and reliability. An approach to the integration of the multidisciplinary analysis and design in power electronics is described. Its main goal is to enable effective analysis of the multidisciplinary interactions at higher levels of accuracy than can be achieved with the simplified algebraic models customarily used today. The major components of the approach are integration of the well-known modeling and analysis techniques that already exist in different disciplines, and the development of systematic techniques for model reduction and automated parameter extraction based on the spatial, temporal and functional distribution of the physical phenomena. The core methodology for achieving this goal is the efficient integration of the computer aided design software tools that are commercially available and proven in different disciplines, based on the use and further development of the existing open standards for software integration. The feasibility of the approach is illustrated through two examples of integrated analysis used for parametric study of the tradeoff between the electromagnetic interference and thermal performance of a simple integrated power electronics module.

   Technologies for Passive Component Integration in Power Conversion
By C. O'Mathuna; T. O'Donnell; S. O'Reilly; P. McCloskey [View]
[Download]

Abstract: The trend in DC-DC power conversion towards increasing power density is placing greater importance on packaging strategies, which give increased levels of integration particularly for the passive components. It is highly desirable to use manufacturing technologies in which it is possible to combine conductive, dielectric and magnetic materials using the same process. This paper reviews three technologies, thick film ceramic, printed circuit board, and thin film on Silicon, which have the potential to provide passive component integration in DC-DC power conversion applications. Recent developments in these technologies and their application to integrated passives for power conversion is discussed.

   The Development of Planar High Density Hybrid Integration Technologies for Power Electronics
By Z. Liang; J. D. Van Wyk; S. Wen; S.-Y. Lee; D. W. Huff; W. G. Odendaal; J. T. Strydom [View]
[Download]

Abstract: The paper discusses the hybrid planar technologies developed to integrate power electronic converters in the multi-kilowatt range. These developments enable integration of the power passives with the rest of the converter and do not make use of wirebonds as an interconnecting technology. Examples of integration are presented and the characteristics discussed. Thermo-mechanical analysis by analytical, simulation and experimental methods are presented.

EPE-PEMC 2002: Special Session: Packing and Integration of Power Electronic Converters
You are here: EPE Documents > 04 - EPE-PEMC Conference Proceedings > EPE-PEMC 2002 - Conference > EPE-PEMC 2002: Special Session: Packing and Integration of Power Electronic Converters
	[return to parent folder]

	Comparison of spray cooling with direct liquid base-plate flow convection of IGBT power modules By G. Lefranc; G. Mitic; W. Kiffe; S. Ramminger; D. E. Tilton; B. A. Smetana; T. D. Weir	[View] [Download]
Abstract: Removing the dissipated heat directly from the surface of the chip by means of spray cooling increases the efficiency of cooling and reduces the temperature gradients at the chip surface. Both together lead to a significant increase in the reliability of the whole system. A demonstration system with a eupec BSM 150 IGBT module was built to show the efficiency of spray cooling for high power dissipation in electronic power modules. The maximum power dissipation of the module is rated at 1250 W. IGBTs with heat dissipation of almost 200 W/cm2 were successfully cooled by spray cooling using a Perfluorinated inert liquid (Fluorinert). The transient electrical measurements showed that the thermal resistance between the junction and the ambient was 0.064 K/W in the case of spray cooling in contrast to 0.075 K/W for direct flow convection between water and baseplate.

	High Power Densities with Three Dimensional Integration By J. A. Ferreira	[View] [Download]
Abstract: A trend exists towards higher power densities in power electronic, driven by the applications market and new technologies.The hybrid integration of semiconductor devices represents the first level of power electronic integration. At higher levels passive components will be included in the same package and eventually complete power electronic converters could be integrated. This calls not only for more compact three dimensional packaging techniques but electromagnetic integration of the passive circuit functions and integrated heat management of all the circuit components. In the paper various issues for achieving high power densities and higher levels of integration are discussed including geometrical packaging, electromagnetic and thermal issues.

	Integrated Multidisciplinary Modeling, Analysis and Design in Power Electronics By J. Z. Chen; D. Boroyevich	[View] [Download]
Abstract: Due to the nature of electronic power processing, the design of power electronics components, converters and systems has always involved many disciplines: from circuits and solid-state physics, to electromagnetics, systems and control, thermodynamics, structural mechanics, material science and reliability. An approach to the integration of the multidisciplinary analysis and design in power electronics is described. Its main goal is to enable effective analysis of the multidisciplinary interactions at higher levels of accuracy than can be achieved with the simplified algebraic models customarily used today. The major components of the approach are integration of the well-known modeling and analysis techniques that already exist in different disciplines, and the development of systematic techniques for model reduction and automated parameter extraction based on the spatial, temporal and functional distribution of the physical phenomena. The core methodology for achieving this goal is the efficient integration of the computer aided design software tools that are commercially available and proven in different disciplines, based on the use and further development of the existing open standards for software integration. The feasibility of the approach is illustrated through two examples of integrated analysis used for parametric study of the tradeoff between the electromagnetic interference and thermal performance of a simple integrated power electronics module.

	Technologies for Passive Component Integration in Power Conversion By C. O'Mathuna; T. O'Donnell; S. O'Reilly; P. McCloskey	[View] [Download]
Abstract: The trend in DC-DC power conversion towards increasing power density is placing greater importance on packaging strategies, which give increased levels of integration particularly for the passive components. It is highly desirable to use manufacturing technologies in which it is possible to combine conductive, dielectric and magnetic materials using the same process. This paper reviews three technologies, thick film ceramic, printed circuit board, and thin film on Silicon, which have the potential to provide passive component integration in DC-DC power conversion applications. Recent developments in these technologies and their application to integrated passives for power conversion is discussed.

	The Development of Planar High Density Hybrid Integration Technologies for Power Electronics By Z. Liang; J. D. Van Wyk; S. Wen; S.-Y. Lee; D. W. Huff; W. G. Odendaal; J. T. Strydom	[View] [Download]
Abstract: The paper discusses the hybrid planar technologies developed to integrate power electronic converters in the multi-kilowatt range. These developments enable integration of the power passives with the rest of the converter and do not make use of wirebonds as an interconnecting technology. Examples of integration are presented and the characteristics discussed. Thermo-mechanical analysis by analytical, simulation and experimental methods are presented.