| Abstract |
The trend in DC-DC power conversion towards increasing power density is placing greater importance on packaging strategies, which give increased levels of integration particularly for the passive components. It is highly desirable to use manufacturing technologies in which it is possible to combine conductive, dielectric and magnetic materials using the same process. This paper reviews three technologies, thick film ceramic, printed circuit board, and thin film on Silicon, which have the potential to provide passive component integration in DC-DC power conversion applications. Recent developments in these technologies and their application to integrated passives for power conversion is discussed. |
