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The Development of Planar High Density Hybrid Integration Technologies for Power Electronics
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| Author(s) |
Z. Liang; J. D. Van Wyk; S. Wen; S.-Y. Lee; D. W. Huff; W. G. Odendaal; J. T. Strydom |
| Abstract |
The paper discusses the hybrid planar technologies developed to integrate power electronic converters in the multi-kilowatt range. These developments enable integration of the power passives with the rest of the converter and do not make use of wirebonds as an interconnecting technology. Examples of integration are presented and the characteristics discussed. Thermo-mechanical analysis by analytical, simulation and experimental methods are presented. |
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| Filename: | EPE-PEMC2002 - SSJAF-01 - Liang.pdf |
| Filesize: | 1.159 MB |
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| Type |
Members Only |
| Date |
Last modified 2004-05-12 by System |
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