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High Power Densities with Three Dimensional Integration
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| Author(s) |
J. A. Ferreira |
| Abstract |
A trend exists towards higher power densities in power electronic, driven by the applications market
and new technologies.The hybrid integration of semiconductor devices represents the first level of
power electronic integration. At higher levels passive components will be included in the same
package and eventually complete power electronic converters could be integrated. This calls not only
for more compact three dimensional packaging techniques but electromagnetic integration of the
passive circuit functions and integrated heat management of all the circuit components. In the paper
various issues for achieving high power densities and higher levels of integration are discussed
including geometrical packaging, electromagnetic and thermal issues. |
| Download |
| Filename: | EPE-PEMC2002 - SSJAF-02 - Ferreira.pdf |
| Filesize: | 657.2 KB |
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| Type |
Members Only |
| Date |
Last modified 2004-05-12 by System |
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