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Comparison of spray cooling with direct liquid base-plate flow convection of IGBT power modules
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| Author(s) |
G. Lefranc; G. Mitic; W. Kiffe; S. Ramminger; D. E. Tilton; B. A. Smetana; T. D. Weir |
| Abstract |
Removing the dissipated heat directly from the surface of the chip by means of spray
cooling increases the efficiency of cooling and reduces the temperature gradients at the chip surface.
Both together lead to a significant increase in the reliability of the whole system. A demonstration
system with a eupec BSM 150 IGBT module was built to show the efficiency of spray
cooling for high power dissipation in electronic power modules. The maximum power dissipation
of the module is rated at 1250 W. IGBTs with heat dissipation of almost 200 W/cm2 were successfully
cooled by spray cooling using a Perfluorinated inert liquid (Fluorinert). The transient electrical
measurements showed that the thermal resistance between the junction and the ambient was
0.064 K/W in the case of spray cooling in contrast to 0.075 K/W for direct flow convection between
water and baseplate. |
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| Filename: | EPE-PEMC2002 - SSJAF-04 - Lefranc.pdf |
| Filesize: | 308.3 KB |
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| Type |
Members Only |
| Date |
Last modified 2004-05-12 by System |
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