EPE Association: EPE 2003 - Topic 01f: Thermal Design

EPE 2003 - Topic 01f: Thermal Design
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2003 - Conference > EPE 2003 - Topic 01: DEVICES > EPE 2003 - Topic 01f: Thermal Design

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   Transient termal simulations of power integrated circuits using analytical solution of heat equation
By M. Janicki; A. Napieralski [View]
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Abstract: The paper presents a method for simulation of transient thermal responses in electronic circuits based on an analytical solution of the heat equation. In order to obtain fully three-dimensional analytical time dependent solutions of the heat equation, the authors employ the original method in which the solution is found using the Green’s functions. The Green’s functions required for the solution are determined using a Galerkin-based integral method. The proposed solution method is illustrated in detail on the particular example concerning the simulations of the heating process of a power integrated circuit. The thermal simulations are validated both with infrared and p-n junction temperature measurements. Additionally, the discussion of errors caused by different non-linear phenomena is included.

   Thermal performance of ISODRAIN package
By R. Kling; M. Pürschel [View]
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Abstract: This paper describes a new package approach with an isolation between the backside of the chip and the leadframe. Typical application fields are integrated switch mode power supplies (SMPS) solutions like the CoolSET, using a PWM-IC and a high voltage power MOSFET within one package. A thermal analyses using the delta-VSD test has been taken to evaluate the influence of such a package in a realistic surrounding. The results were evaluated in terms of savings on the MOSFET size and maximum power ranges.

   Development and test of a silicon grooved heat pipe for cooling of electronic components
By Y. Avenas; N. Cézac; C. Schaeffer [View]
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Abstract: Today power electronics cooling is became a crucial problem. In order to dissipate large heat flux densities, the use of materials with a high thermal conductivity seems to be very interesting. Indeed they provide a good heat spreading and thus a decrease of the thermal resistance of the heat sink. In this paper, we show why passive heat exchangers, called heat pipes, are able to replace these materials. The interest of silicon etching techniques for heat pipe manufacturing is also demonstrated: such heat pipes can be very compact, very light and have a better hydraulic behavior than metallic heat pipes. A theoretical study shows that the effective thermal conductivity of a 2D grooved heat pipe can be 800 W/m/K i.e. a value two times larger that that of copper. The last part deals with an experimental study which shows that this heat pipe works very well in all orientations.

   Electro-thermo-fluidic simulation of a complete IGBT modules packaging application to the transient state simulation of a low frequency PWM - VSI
By H. Feral; J-P. Fradin; F. Richardeau; J. Vallon; P. Ladoux [View]
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Abstract: This paper presents a global electro-thermo-fluidic modeling methodology applied on an IGBT inverter. The method is based on three coupled models (electrical, fluidic and thermal). The temperature field in the full power module is computed from the inverter electrical operating point and the cooling fan supply voltage. Each model uses specific software and is validated by measures. This global model enables the surges capabilities assessment and the predictive reliability. That is why the steady state and the transient’s temperature evolution are presented in the paper. Transient’s results show the low modulation frequency impact on the die power losses and on the die temperature.

   Precise temperature measurement and heat flow generation for determination of thermal properties of liquid cooling systems for power semiconductors
By R. Seebacher; K. Krischan; R. Ingruber

Abstract: For the determination of cooling systems for power semiconductors a test rig is build up with heating elements, temperature sensors, thermal isolation and spacing elements, providing reproducible positioning of the heating elements and sensors on the surface of the heat sink. A calibration method for platinum resistance thermometers is presented (accuracy ±0.1K). Heating elements to induce the desired heat flow are developed. Heat flow is verified by FEM computations and experimental setup.

EPE 2003 - Topic 01f: Thermal Design
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2003 - Conference > EPE 2003 - Topic 01: DEVICES > EPE 2003 - Topic 01f: Thermal Design
	[return to parent folder]

	Transient termal simulations of power integrated circuits using analytical solution of heat equation By M. Janicki; A. Napieralski	[View] [Download]
Abstract: The paper presents a method for simulation of transient thermal responses in electronic circuits based on an analytical solution of the heat equation. In order to obtain fully three-dimensional analytical time dependent solutions of the heat equation, the authors employ the original method in which the solution is found using the Green’s functions. The Green’s functions required for the solution are determined using a Galerkin-based integral method. The proposed solution method is illustrated in detail on the particular example concerning the simulations of the heating process of a power integrated circuit. The thermal simulations are validated both with infrared and p-n junction temperature measurements. Additionally, the discussion of errors caused by different non-linear phenomena is included.

	Thermal performance of ISODRAIN package By R. Kling; M. Pürschel	[View] [Download]
Abstract: This paper describes a new package approach with an isolation between the backside of the chip and the leadframe. Typical application fields are integrated switch mode power supplies (SMPS) solutions like the CoolSET, using a PWM-IC and a high voltage power MOSFET within one package. A thermal analyses using the delta-VSD test has been taken to evaluate the influence of such a package in a realistic surrounding. The results were evaluated in terms of savings on the MOSFET size and maximum power ranges.

	Development and test of a silicon grooved heat pipe for cooling of electronic components By Y. Avenas; N. Cézac; C. Schaeffer	[View] [Download]
Abstract: Today power electronics cooling is became a crucial problem. In order to dissipate large heat flux densities, the use of materials with a high thermal conductivity seems to be very interesting. Indeed they provide a good heat spreading and thus a decrease of the thermal resistance of the heat sink. In this paper, we show why passive heat exchangers, called heat pipes, are able to replace these materials. The interest of silicon etching techniques for heat pipe manufacturing is also demonstrated: such heat pipes can be very compact, very light and have a better hydraulic behavior than metallic heat pipes. A theoretical study shows that the effective thermal conductivity of a 2D grooved heat pipe can be 800 W/m/K i.e. a value two times larger that that of copper. The last part deals with an experimental study which shows that this heat pipe works very well in all orientations.

	Electro-thermo-fluidic simulation of a complete IGBT modules packaging application to the transient state simulation of a low frequency PWM - VSI By H. Feral; J-P. Fradin; F. Richardeau; J. Vallon; P. Ladoux	[View] [Download]
Abstract: This paper presents a global electro-thermo-fluidic modeling methodology applied on an IGBT inverter. The method is based on three coupled models (electrical, fluidic and thermal). The temperature field in the full power module is computed from the inverter electrical operating point and the cooling fan supply voltage. Each model uses specific software and is validated by measures. This global model enables the surges capabilities assessment and the predictive reliability. That is why the steady state and the transient’s temperature evolution are presented in the paper. Transient’s results show the low modulation frequency impact on the die power losses and on the die temperature.

	Precise temperature measurement and heat flow generation for determination of thermal properties of liquid cooling systems for power semiconductors By R. Seebacher; K. Krischan; R. Ingruber
Abstract: For the determination of cooling systems for power semiconductors a test rig is build up with heating elements, temperature sensors, thermal isolation and spacing elements, providing reproducible positioning of the heating elements and sensors on the surface of the heat sink. A calibration method for platinum resistance thermometers is presented (accuracy ±0.1K). Heating elements to induce the desired heat flow are developed. Heat flow is verified by FEM computations and experimental setup.