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Transient termal simulations of power integrated circuits using analytical solution of heat equation
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| Author(s) |
M. Janicki; A. Napieralski |
| Abstract |
The paper presents a method for simulation of transient thermal responses in electronic circuits based
on an analytical solution of the heat equation. In order to obtain fully three-dimensional analytical time
dependent solutions of the heat equation, the authors employ the original method in which the solution
is found using the Green’s functions. The Green’s functions required for the solution are determined
using a Galerkin-based integral method. The proposed solution method is illustrated in detail on the
particular example concerning the simulations of the heating process of a power integrated circuit. The
thermal simulations are validated both with infrared and p-n junction temperature measurements.
Additionally, the discussion of errors caused by different non-linear phenomena is included. |
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| Filename: | EPE2003-PP0142 - Janicki |
| Filesize: | 254.2 KB |
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| Type |
Members Only |
| Date |
Last modified 2003-10-14 by Unknown |
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