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   Precise temperature measurement and heat flow generation for determination of thermal properties of liquid cooling systems for power semiconductors 
 Author(s)   R. Seebacher; K. Krischan; R. Ingruber 
 Abstract   For the determination of cooling systems for power semiconductors a test rig is build up with heating elements, temperature sensors, thermal isolation and spacing elements, providing reproducible positioning of the heating elements and sensors on the surface of the heat sink. A calibration method for platinum resistance thermometers is presented (accuracy ±0.1K). Heating elements to induce the desired heat flow are developed. Heat flow is verified by FEM computations and experimental setup. 
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 Type   Members Only 
 Date   Last modified 2004-01-27 by Unknown