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Electro-thermo-fluidic simulation of a complete IGBT modules packaging application to the transient state simulation of a low frequency PWM - VSI
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Author(s) |
H. Feral; J-P. Fradin; F. Richardeau; J. Vallon; P. Ladoux |
Abstract |
This paper presents a global electro-thermo-fluidic modeling methodology applied on an IGBT
inverter. The method is based on three coupled models (electrical, fluidic and thermal). The
temperature field in the full power module is computed from the inverter electrical operating point and
the cooling fan supply voltage. Each model uses specific software and is validated by measures.
This global model enables the surges capabilities assessment and the predictive reliability. That is why
the steady state and the transient’s temperature evolution are presented in the paper. Transient’s results
show the low modulation frequency impact on the die power losses and on the die temperature. |
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Filename: | EPE2003-PP0671 - Feral |
Filesize: | 1008 KB |
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Type |
Members Only |
Date |
Last modified 2004-01-21 by Unknown |
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