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Thermal performance of ISODRAIN package
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| Author(s) |
R. Kling; M. Pürschel |
| Abstract |
This paper describes a new package approach with an isolation between the backside of the chip and
the leadframe. Typical application fields are integrated switch mode power supplies (SMPS) solutions
like the CoolSET, using a PWM-IC and a high voltage power MOSFET within one package. A
thermal analyses using the delta-VSD test has been taken to evaluate the influence of such a package in
a realistic surrounding. The results were evaluated in terms of savings on the MOSFET size and
maximum power ranges. |
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| Filename: | EPE2003-PP0217 - Kling |
| Filesize: | 266.7 KB |
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| Type |
Members Only |
| Date |
Last modified 2003-10-14 by Unknown |
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