| EPE 2013 - DS1a: Passive components,system integration and packaging |
| You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2013 ECCE Europe - Conference > EPE 2013 - Topic 02: Passive components, system integration & packaging > EPE 2013 - DS1a: Passive components,system integration and packaging |
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 | A Methodology for Studying Aluminum Electrolytic Capacitors Wear-out in Automotive Cases
By Romain COUSSEAU, Nicolas PATIN, Eric MONMASSON, Lahoucine IDKHAJINE | [View]
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Abstract: Electrolytic aluminum capacitors used in electric drive for automotive are deemed to be the weakest components of static power converters. A lot of studies have been made to estimate their aging but only for a nominal point. This paper presents a specific operation cycle implementation to study the impact of a variable and more realistic thermal cycling. Moreover, an improvement of the classical electrical model for an electrolytic capacitor is proposed by adding a diffusion-relative element called “anomalous diffusion”. Experimental results show the interest of this element for an impedance-fitting. Finally, thermal measurements validate thermal cycling simulations.
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| | A review on real time physical measurement techniques and their attempt to predict wear out status of IGBT
By Pramod GHIMIRE, Stig MUNK-NIELSEN, Paul THØGERSEN, Bjorn RANNESTAD | [View]
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Abstract: Insulated Gate Bipolar Transistors (IGBTs) are key component in power converters. Reliability of power converters depend on wear-out process of power modules. A physical parameter such as the on-state collector-emitter voltage (Vce) shows the status of degradation of the IGBT after a certain cycles of operation. However, the Vce mainly shows the wear-out of bond wire lift-off and solder degradation. The Vce is normally used to estimate the junction temperature in the module. The measurement of Vce is sensitive to the converter power level and fluctuations in the surrounding temperature. In spite of difficulties in the measurement, the offline and online Vce measurement topologies are implemented to study the reliability of the power converters. This paper presents a review in wear-out prediction methods of IGBT power modules and freewheeling diodes based on the real time Vce measurement. The measurement quality and some practical issues of those measurement techniques are discussed. Furthermore, the paper proposes the requirements for the measurement and prognostic approach to determine wear-out status of power modules in field applications. The online Vce measurement for a selected topology is also shown in the paper.
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| | Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates
By Tilo POLLER, Bianca BOETTGE, Heiko KNOLL, Folkhart GRIEGER, Andreas LINDEMANN, Josef LUTZ | [View]
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Abstract: DAB are a new kind of substrates in which the copper layer was replaced by an aluminum layer. In [1] a increase of the roughness of these aluminum layer was observed during thermal cycling tests. A similar effect was observed during power cycling tests in [2, 3]. This paper will discuss this effect with experimental results and Finite Element (FEM) simulations.
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| | Automatic Design Optimisation for Power Electronics Modules Based on Rapid Dynamic Thermal Analysis
By Paul EVANS, Alberto CASTELLAZZI, Serhiy BOZHKO, Mark JOHNSON | [View]
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Abstract: A novel approach is presented that shows how mathematical optimisation algorithms can be applied to optimise multi-chip power electronic modules based on their dynamic thermal performance. By using Model Order Reduction techniques which allow rapid dynamic thermal simulation and evaluation of potential designs, even optimisation algorithms that require a large number of design evaluations can be used to determine theoretical optimum designs within realistic time-scales on a standard desktop PC. The optimisation approach has been integrated into prototype power electronics design software under development and an overview of this software is first given. The optimisation approach is then demonstrated by means of two simple multichip power module examples.
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| | Determination of the thermal and electrical contact resistance of press pack housings
By Tilo POLLER, Salvatore D'ARCO, Magnar HERNES, Josef LUTZ | [View]
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Abstract: Press-pack IGBTs are manufactured with a multi-layered structure composed of internal layers with different geometrical shape and physical properties. The device is clamped and an external pressure is applied on the housing in order to establish a sufficient electrical and thermal contact between these layers. The modeling of interlayer contact resistances is necessary to characterize the behaviour of the device in Finite Element Methods (FEM) simulations. However, this modeling task can be difficult since they are pressure sensitive and cannot be easily determined by a direct measurement. This paper presents a method to identify these contact resistances combining FEM analyses with experimental measurements only on the external surfaces of the chip assembly. Indeed, the method procedes with an iterative process where contact resistances are changed according to a genetic search algorithm in order to match the results of the FEM simulations with the experimental measurements.
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| | Dynamically adapting equivalent circuit model describing the EMI behaviour of magnetic components
By Daniel KUEBRICH, Anne-Christine LEICHT, Manfred ALBACH, Fabian DIEPOLD | [View]
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Abstract: It is necessary to take the parasitic elements of passive components into consideration in order to predict generated EMI noise of converters and power electronic systems. Parasitic capacitances in magnetic components usually form the major coupling path. Therefore these capacitances must be known in order to predict the noise generation by simulation. This paper presents a dynamically adapting equivalent circuit model of magnetic components based on two separate 2-D FEM simulation runs. This model allows predicting high frequency behaviour accurately.
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| | Evaluation of the submodel technique for FEM simulations of power electronic housings under power cycling conditions
By Kay HOFMANN, Lukas TINSCHERT, Tilo POLLER, Josef LUTZ | [View]
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Abstract: The submodel technique was mainly developed in mechanical engineering for complex parts and assemblies. In the simulations of microelectronics housing the technique was successful implemented for thermal cycling conditions. In thispaper the evaluation of the submodel technique for power electronic packages under power cycling conditions will be discussed.
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| | High Frequency Modeling of the Winding Wires of AC Machines
By Ignace RASOANARIVO, Christophe TIREL, Nouredddine TAKORABET, Francois Michel SARGOS | [View]
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Abstract: The present paper deals with the modeling in high frequency of AC machines windings, when the coils are subjected to fast slopes of MLI voltage. The purpose of this study is twofold: firstly, to develop a network of the electrical circuit, and secondly, to effectuate a behavioral analysis. The different elements of this network will be identified by Finite Element Calculations thanks to COMSOL MULTIPHYSIC software, and a behavioral analysis of this network is simulated by MATLAB SIMULINK. This analysis confirms the occurrence of voltage spikes in the first few turns of the coil. Finally, an improvement to face these surges is proposed, consisting in modification of the coupling of partial coils of the winding. Simulated and experimental results are matching well and highlight the merits of the present approach.
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| | High Temperature, High Frequency Micro-Inductors for Low Power DC-DC Converters
By Christian MARTIN, Elias HADDAD, Cyril BUTTAY, Charles JOUBERT, Bruno ALLARD, Dominique BERGOGNE | [View]
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Abstract: The development of micro-inductors is still a challenge to improve the integration level of low power DC-DC converters. The temperature rise due to self-heating or higher ambient temperature represents a risk for system operation. Unfortunately, the use of a heat sink increases the size of the converter and it is more difficult to extract the heat flow dissipated from a smaller area. The increase in the allowable operating temperature offers a solution to achieve a high integration level while ensuring proper heat management. This paper presents the fabrication process of micro-planar inductors with magnetic layers (YIG). The influence of the temperature on the magnetic material and on the inductor performances is studied up to 280 °C. Fabricated micro-inductors are tested using a LCR meter in the 10 kHz to 110 MHz frequency range and over a large temperature range, from 30 °C to 280 °C.
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| | Improved test bench for active ageing of power modules reproducing constraints close to automotive driving conditions
By Souad BACHTI, Laurent DUPONT, Serge LOUDOT, Gerard COQUERY | [View]
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Abstract: Power modules designed for hybrid/electric traction should fulfil lean manufacturing considerations. Robustness study of IGBT modules on the basis of a representative driving cycle is mandatory for safety reasons, cost and lifetime estimation. So power modules can not be oversized and harsh stresses applied conduct to review ageing tests. The power modules for motor drives are subject to multiple failure modes which are due to many damaging factors. Generally we perform the damage evaluation of power modules by thermal and active accelerated power cycling tests. In order to take into account of new automotive domain requirements, this paper proposes a tester applying low voltage electro-thermal stresses on power module close to the automotive urban driving conditions
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| | Integrated Coreless Transformer for High Temperatures Design and Evaluation
By Dominique BERGOGNE, Christian MARTIN, Pascal BEVILACQUA, Wided ZINE, Jean-Christophe RIOU, Hilal EZZEDDINE, Regis MEURET, Bruno ALLARD | [View]
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Abstract: A novel coreless technology based on an existing process, initially designed to produce integrated passive components for commercial temperatures, is used and its capability at 200°C is tested. Design aspects and electrical characterizations of the samples are presented. Finally, an endurance test shows a satisfactory behaviour at high temperatures.
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| | Integrated hybrid EMI filter: Study and Realization of the Active Part
By Marwan ALI, Francois COSTA, Eric LABOURE | [View]
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Abstract: Based on the EMI converter model, a hybrid EMI filter is proposed. The chosen active filtering circuit is integrated on the PCB using the passive integrated part. Theoretical and realization results show the integration compatibility between the active part and the passive part. Then EMI measurements show that the proposed integrated hybrid filter can greatly reduce the noise at high and low frequencies while reducing the overall bulkiness.
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| | Interconnection technology for new wide band gap semiconductors
By Cyrille DUCHESNE, Philippe CUSSAC, Xavier CHAUFFLEUR | [View]
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Abstract: The aim of this works is to present the interconnection technology bump that allows a double side cooling for power modules. Research will focus on pushing the limits necessitated by the increase of power density on the components to ensure optimum integration. We present design principles, electrical characteristics and thermal gains obtained by the use of this technology.
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| | Laminated Magnetic Materials Losses Analysis under Non-Sinusoidal Flux Waveforms in Power Electronics Systems
By Davide AGUGLIA, Michel NEUHAUS | [View]
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Abstract: Losses analyses of laminated magnetic materials subject to non-sinusoidal magnetic flux arepresented. Comparative analyses on typical Fe-Si oriented and non-oriented grains andnanocrystalline materials are carried out considering the influence of harmonic phase shift andassociated B-H minor loops. Experimental measurements are performed to illustrate the B-Hcharacteristics behaviours. A special experimental effort is given on nanocrystalline material, whereSteinmetz coefficients are experimentally identified to analyse the performances of the improvedGeneralized Steinmetz Equation (iGSE) when phase displaced minor loops occur. It is proven that theiGSE is efficient in predicting nanocrystalline losses versus variable phase displaced harmonics.
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| | Limitation of DC-side Stray Inductance by Considering Over Voltage and Short-circuit Current
By Masato ANDO, Keiji WADA | [View]
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Abstract: This paper presents a design procedure of the DC-side stray inductance for high-speed switching circuitusing SiC power devices considering an over voltage and a short-circuit current. In order to verify theanalysis results of the over voltage and the short-circuit current, the experiments are conducted. Moreover,the design procedure of the DC-side wiring structure considering the stray inductance is discussedwith using an inductance map.
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| | Loss Measurement of Magnetic Components under real Application Conditions
By Thiemo KLEEB, Samuel ARAUJO, Benjamin DOMBERT, Peter ZACHARIAS | [View]
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Abstract: Due to the increasing demand for highly efficient power electronic converters, a detailed design targeting each individual circuit component like magnetic components is getting more and more important. Several electric and calorimetric methods for the loss measurement of magnetic components are known from literature. Nevertheless, only the last approach can be used to properly perform measurements under real application conditions, i.e. when the magnetic component is driven with high frequency rectangular voltages. As a common drawback, calorimetric methods usually require long measurement periods. This paper will present a calorimetric measurement method to reduce the measurement time, thus enabling the realisation of large test series in order to obtain extended core loss data of magnetic materials. Furthermore, a method to extract core losses of magnetic materials with the help of calorimetric setups will be presented. A mathematical approach for the multidimensional fitting of measurement data will be shown in order to allow the modelling of the specific core losses regarding the multitude of influencing parameters (e.g. induction, frequency, DC bias, temperature, duty cycle). It will be shown that a core loss model based on data obtained by measurement under real application conditions can lead to superior accuracy.
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| | Low-profile small-size ferrite cores for powerSiP integrated inductors
By Thi Yen Mai NGUYEN, Magali BRUNET, Jean-Pierre LAUR, David BOURRIER, Samuel CHARLOT, Zarel VALDEZ, Vincent BLEY, Celine COMBETTES | [View]
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Abstract: Ferrite-based micro-inductors integrated on silicon are proposed as potential hybrid integration in low-power medium frequency DC-DC power converters. The inductors are fabricated at wafer level using micromachining and flip chip assembling techniques. The proposed process is based on a sintered ferrite core placed in between thick electroplated copper windings on two silicon substrates. The low profile (110 µm thick) ferrite cores are produced by thermal bonding of two green tape-casted films of 1.2 × 2.6 × 0.2 mm3, then micro-milled to the final dimensions before sintering. This paper presents the magnetic characterization of the sintered ferrite films cut in rectangular shape and sintered at different temperatures. It is concluded that these small dimension cores could be used in the frequency range applications of 5-10 MHz and would potentially allow a high inductance density in a 3D integration process.
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| | Methodology for Identifying Wire Bond Process Quality Variation Using Ultrasonic Current Frequency Spectrum
By Elaheh ARJMAND, Pearl A. AGYAKAWA, Mark JOHNSON | [View]
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Abstract: Life time prediction of power electronic modules is becoming increasingly important in order to reduce unscheduled maintenance and unexpected failures. Recent developments in life time estimation of standard power electronic modules determine the nominal life time degradation under operating conditions and/or under harsh environments. However, it is important to obtain life time degradation information considering underling process variation originating from the manufacturing line. In this work, a methodology for obtaining a non-destructive assessment of bonding quality is investigated. This is done with the view of capturing information about bonding quality prior to service exposure, and hence determining the effect of the observed variation in bond quality on reliability. Analysis of the frequency spectra of signals obtained from the ultrasonic generator of a wire bond machine reveals it is a process sensitive parameter. The analyzed results show a good correlation between the frequency and amplitude values of the generator output signals and bond quality. 3D x-ray scans of bonds provide further non-destructive evaluation and validate the observed link between the observed generator output signals and bond quality.
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| | Novel Copper Metallization on Silicon Carbide electronic Devices enabling increased Packaging Lifetime and higher Junction-Temperatures
By Tim BEHRENS, Thomas SUENNER, Thomas KADEN, Adam TOKARSKI, Andreas SCHLETZ, Lothar FREY | [View]
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Abstract: While aluminum-based metallization schemes on Si and corresponding top-side connections via Al-bonds have been optimized for the last decades and are well understood today, only few investigations have been done on the interaction of thick Cu wire-bonds and copper-metallizations on SiC. In this work the mechanical as well as the electrical interactions of copper-metallization schemes have specially been analyzed and optimized for SiC-devices in high reliability applications. By utilizing temperature storage as well as active and passive temperature cycles at temperatures above 200°C it has been proven, that this metallization together with corresponding Cu-bond connections can enable higher junction-temperatures for SiC power electronic devices.
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| | Optimization of the passive thermal control system of a lithium-ion battery with heat pipes embedded in an aluminum plate
By Kirill MURASHKO, Juha PYRHONEN, Lasse LAURILA | [View]
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Abstract: In the design and operation of batteries, effective heat transfer and protection against high operation temperatures are significant issues affecting the lifetime of the battery. This is particularly the case for batteries intended for hybrid machines, where the peak power and current requirements are high. This paper introduces a structure of the thermal protection system for the high-power lithium-ion batteries to be applied to hybrid machines and a methodology for their optimization. The proposed structure is based on the use of metal plates and heat pipes, providing an opportunity to decrease the nonuniform temperature distribution in pouch-type cells. The efficiency of the proposed thermal control system is verified by modeling in Comsol Multiphysics, which is connected to MATLAB for the optimization of the placement and number of heat pipes. Multidimensional unconstrained nonlinear minimization is applied during the optimization in MATLAB.
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| | Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronics
By Ali IBRAHIM, Zoubir KHATIR | [View]
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Abstract: The reliability of power electronic modules is of utmost importance all the more so since they would be exposed to high ambient temperatures and frequent power cycling. Aging tests at 200°C have been done using power cycling in order to study some packaging materials for high temperature power electronics. Junction temperature swings were performed between 196°C and 245°C and tests have concerned the die attach, wire bond and die metallization materials. Experimental results have shown that AuGe solder material is highly resistant comparatively to a high leaded material. Furthermore, for die top-metal/wire couple, gold material exhibits a better performance compared to Aluminum.
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| | Processing and characterization of a 100 \% low-temperature Ag-sintered three-dimensional structure
By Amandine MASSON, Stephane AZZOPARDI, Francois LE HENAFF, Jean Yves DELETAGE, Eric WOIRGARD, Serge BONTEMPS, Julien JOGUET | [View]
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Abstract: Due to RoHS restrictions, researches on lead-free packaging have increased over the past decade. Low Temperature Joining Techniques (such as silver sintering or Ni-Au Transient Liquid Phase Bonding) are particularly studied because they are processed below 300°C and the attaches obtained are reliable at high temperature. Silver paste sintering technique for die backside attach is now a well-known technology used in both industry and academic research. The objective of this work is to adapt the procedure related to conventional silver paste sintered assembly to produce a three-dimensional module. For such purpose, this paper presents some theoretical considerations on silver sintering in order to briefly introduce the technique. Then, sintering procedures for realizing both die backside attach and three-dimensional structure will be described. Experimental results (electrical and mechanical tests, cross-sections, thermal measurements) will be given and performances of the double-side structure will be compared to die backside attaches and with lead-free solder. This work demonstrates for the first time the feasibility of a 100\% silver sintered three-dimensional module using silicon diodes and Ni-Au substrate. Mechanical properties of the two attach-packages are better than classical solders and the performances of each attach are similar to silver sintered die backside attach. These promising results open the way to the use of silicon devices for high power density assemblies because the dice will be cooled down on both sides. This technology just requires silver metallization on the two sides of the device and can be extended to new materials such SiC or GaN for high temperature applications.
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| | Robustness Requirements on Semiconductors for High Power Applications
By Mark-Matthias BAKRAN, Andreas NAGEL | [View]
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Abstract: Robustness of power semiconductors is a key parameter for reliable converter operation. This paperdiscusses the main robustness characteristics limiting the performance in high power converters. Itshows necessary design precautions for the circuit design and also explains where the semiconductormanufacturer has to improve the devices with the aim of maximum electrical exploitation of thesemiconductor.
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| | Temperature Control for Reduced Thermal Cycling of Power Devices
By Xiang WANG, Alberto CASTELLAZZI, Pericle ZANCHETTA | [View]
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Abstract: This paper presents a design and experimental validation of a temperature feedback control scheme to realize the reduction of temperature variation amplitude of power devices or modules. A full-order observer state-space thermal model enables estimation and control of the temperature at reliability critical locations only measuring one accessible location.
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| | The Copper Losses of Litz-Wire Windings Due to an Air Gap
By Alexander STADLER, Christof GULDEN | [View]
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Abstract: In this paper, a systematic procedure is presented, how to predict the AC resistance of litz-wire windings considering air gap fringing fields. For this purpose, an equivalent complex permeability model is derived for hexagonally packed wires. It is shown, how finite element method (FEM) can be used to determine the real as well as the imaginary part of the complex permeability with the copper filling factor as a parameter. A further FEM-model is deduced to describe the air gap fringing fields of gapped inductors. Accordingly, the exact proximity losses of the litz-wire winding are determined correctly and the AC resistance of practical inductors can be predicted over a wide frequency range with high accuracy. This offers the opportunity to optimize such components. Finally, the influence of various parameters on the copper losses is investigated and verified by means of experimental data drawn from impedance measurements.
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