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Interconnection technology for new wide band gap semiconductors
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| Author(s) |
Cyrille DUCHESNE, Philippe CUSSAC, Xavier CHAUFFLEUR |
| Abstract |
The aim of this works is to present the interconnection technology bump that allows a double side cooling for power modules. Research will focus on pushing the limits necessitated by the increase of power density on the components to ensure optimum integration. We present design principles, electrical characteristics and thermal gains obtained by the use of this technology. |
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| Filename: | 0738-epe2013-full-16332812.pdf |
| Filesize: | 650.3 KB |
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| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
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