| |
Evaluation of the submodel technique for FEM simulations of power electronic housings under power cycling conditions
| [View]
[Download]
|
| Author(s) |
Kay HOFMANN, Lukas TINSCHERT, Tilo POLLER, Josef LUTZ |
| Abstract |
The submodel technique was mainly developed in mechanical engineering for complex parts and assemblies. In the simulations of microelectronics housing the technique was successful implemented for thermal cycling conditions. In thispaper the evaluation of the submodel technique for power electronic packages under power cycling conditions will be discussed. |
| Download |
| Filename: | 0731-epe2013-full-11063364.pdf |
| Filesize: | 617.5 KB |
|
| Type |
Members Only |
| Date |
Last modified 2014-02-09 by System |
| |
 |