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Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling
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| Author(s) |
Asger BJØRN JØRGENSEN, Szymon BECZKOWSKI, Benjamin FUTTRUP KJÆRSGAARD, Thore STIG AUNSBORG, Stig MUNK-NIELSEN, Hongbo ZHAO |
| Abstract |
A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained. |
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| Filename: | 0404-epe2023-full-13592587.pdf |
| Filesize: | 4.222 MB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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