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 EPE-PEMC 2004 - Topic 01-8: Reliability of devices 
 You are here: EPE Documents > 04 - EPE-PEMC Conference Proceedings > EPE-PEMC 2004 - Conference > EPE-PEMC 2004 - Topic 01: DEVICES > EPE-PEMC 2004 - Topic 01-8: Reliability of devices 
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   Influence Of The Surface Leakage Current On Reliability Of Power Silicon Devices Operated At High Junction Temperature 
 By V. V. N. Obreja(ro), C. Codreanu(ro), K. I. Nuttall(uk), O. Buiu(uk), C. Podaru(ro), A. Obreja(ro), I. Codreanu(ro) 
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Abstract: Experiments on present-day commercial available power diodes, transistors and thyristors reveal a non-negligible surface current component for the leakage current of high voltage blocking junctions. This surface current even as a secondary component is a source of thermal instability for the junction blocking I-V characteristic. For this reason power silicon devices are not able to reliable operate at junction temperature higher than 150-200 oC. Nonetheless, advance in the junction passivation techniques could enable further reduction of the surface leakage current and reliable operation at higher temperature.

 
   Preventive Technical Maintenance Of Pwm And Cyklo Type Power Converters 
 By A. Gasparyan, G. Lauza, V. Uzars 
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Abstract: The parameter concept of safety of power semiconductor devices is offered considering the exeeding certain rationed values of a particular informative parameter as a failure. The results of experimental data as well as statistical analyses are presented in the paper. Statistical models of parameter drift and the forecast of rationed values of informative parameters are offered as the basis for preventive technical maintenance.