EPE Association: EPE 2003 - Topic 02f: Integrated Failure Analysis and Reliability Methods

EPE 2003 - Topic 02f: Integrated Failure Analysis and Reliability Methods
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2003 - Conference > EPE 2003 - Topic 02: POWER ELECTRONIC SYSTEM DESIGN & PACKAGING > EPE 2003 - Topic 02f: Integrated Failure Analysis and Reliability Methods

   [return to parent folder]

   Converter topology for reliability test bench dedicated to PWM inverters
By J. Vallon; F. Richardeau; H. Feral; Y. Cheron; F. Forest; J-J. Huselstein; C. Joubert [View]
[Download]

Abstract: Reliability studies in power electronics are complicated, they require experimental and physical approaches coupled. This paper deals with the study and the conception of a first converter module under strong and controlled stresses. The life-time tests with a great number of their modules will enable us to extract some drifts and reliability data. In this paper, the problems of faults management, the design and the control method of this module will be detailed.

   Torque filtering of star-mounted q-Phase PMSM supplied by q-leg VSIs under fault conditions
By J.P. Martin; S. Pierfederici; F. Meibody-Tabar; B. Davat [View]
[Download]

Abstract: The increase of the phase number of PMSM allows operating with reduced number of supplied phases. But without any precaution, the torque undulation rate becomes important. In this paper we propose a method, based on the modification of the current waveforms of few number of active phases, to filter torque undulations of a star mounted q-phase PMSM supplied by a q-leg VSI with one or more than one non-supplied phases.

   Method for electrical detection of end-of-life failures in power semiconductors
By J. Lehmann; M. Netzel; R. Herzer; S. Pawel; Th. Doll [View]
[Download]

Abstract: A novel approach is presented for detecting bond wire lift-off in power semiconductor devices while they are in operation [1]. The aim is to improve the reliability of power electronic systems. The diagnostic functionality presented makes use of specific bond assemblies and integrated subcircuits, e.g. as part of the gate driver in IPMs, and serves to detect bond wire lift-off in power devices. In power semiconductor modules without base plate, the end-of-life phenomenon of bond wire lift-off is typically the final failure mechanism, either as a primary failure mechanism or as a secondary failure because of solder fatigue. The loss of electrical contact, and therefore the loss of controllability and blocking capability, is a great problem, still not solved by any protection concepts so far made known. Monitoring the onset of the end-of-life phase and implementing redundancy in the system will prevent the power semiconductor module from going abruptly into failure mode, so that the destruction of devices is safely avoided.

EPE 2003 - Topic 02f: Integrated Failure Analysis and Reliability Methods
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2003 - Conference > EPE 2003 - Topic 02: POWER ELECTRONIC SYSTEM DESIGN & PACKAGING > EPE 2003 - Topic 02f: Integrated Failure Analysis and Reliability Methods
	[return to parent folder]

	Converter topology for reliability test bench dedicated to PWM inverters By J. Vallon; F. Richardeau; H. Feral; Y. Cheron; F. Forest; J-J. Huselstein; C. Joubert	[View] [Download]
Abstract: Reliability studies in power electronics are complicated, they require experimental and physical approaches coupled. This paper deals with the study and the conception of a first converter module under strong and controlled stresses. The life-time tests with a great number of their modules will enable us to extract some drifts and reliability data. In this paper, the problems of faults management, the design and the control method of this module will be detailed.

	Torque filtering of star-mounted q-Phase PMSM supplied by q-leg VSIs under fault conditions By J.P. Martin; S. Pierfederici; F. Meibody-Tabar; B. Davat	[View] [Download]
Abstract: The increase of the phase number of PMSM allows operating with reduced number of supplied phases. But without any precaution, the torque undulation rate becomes important. In this paper we propose a method, based on the modification of the current waveforms of few number of active phases, to filter torque undulations of a star mounted q-phase PMSM supplied by a q-leg VSI with one or more than one non-supplied phases.

	Method for electrical detection of end-of-life failures in power semiconductors By J. Lehmann; M. Netzel; R. Herzer; S. Pawel; Th. Doll	[View] [Download]
Abstract: A novel approach is presented for detecting bond wire lift-off in power semiconductor devices while they are in operation [1]. The aim is to improve the reliability of power electronic systems. The diagnostic functionality presented makes use of specific bond assemblies and integrated subcircuits, e.g. as part of the gate driver in IPMs, and serves to detect bond wire lift-off in power devices. In power semiconductor modules without base plate, the end-of-life phenomenon of bond wire lift-off is typically the final failure mechanism, either as a primary failure mechanism or as a secondary failure because of solder fatigue. The loss of electrical contact, and therefore the loss of controllability and blocking capability, is a great problem, still not solved by any protection concepts so far made known. Monitoring the onset of the end-of-life phase and implementing redundancy in the system will prevent the power semiconductor module from going abruptly into failure mode, so that the destruction of devices is safely avoided.