EPE Association: EPE 1999 - Topic 01c: Hybrid Power Integration

EPE 1999 - Topic 01c: Hybrid Power Integration
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 1999 - Conference > EPE 1999 - Topic 01: DEVICES > EPE 1999 - Topic 01c: Hybrid Power Integration

   [return to parent folder]

   State of the Art of Integrated Power Modules (IPMs) for 0.75kW an...
By J. Flannery; M. Meinhardt; P. Cheasty; P. Byrne; S. Cian O'Mathuna; O. Slattery; K. Briggs; P. Barras; B. Drury [View]
[Download]

Abstract: A review of the state of the art of the packaging aspects of integrated power modules (IPMs) for 0.75 kW and 2 kW industrial motor drive applications is presented from the user's perspective. The power electronic packaging aspects of a number of commercial IPMs were analysed in terms of complexity, electrical and thermal performance, build and manufacturability, all factors, which would influence their use and reliability. Results of thermal simulations are presented which compare the dynamic behaviour of the most common module build options in overload operation. Recent trends on packaging of these types of modules are presented.

   Thyristor Intelligent Power Module (IPM) with Temperature Protection
By Z. Lisik; T. Michalski; Z. Szczepaniak; J. Szmidt [View]
[Download]

Abstract: An intelligent power module (IPM) based on bipolar elements is presented. It is a test module with a thyristor AC follow-up switch for group control of AC load. In the IPM, the control and power supply as well as the temperature monitoring and overtemperature protection of semiconductor devices have been integrated. The temperature is measured directly inside the thyristor during its reverse bias, using the forward bias gate-cathode junction as the thermosensor. Operating examination of the test modules has been carried out showns high efficiency of the temperature protection applied to the device. The paper includes the description of the module and the results of the tests.

EPE 1999 - Topic 01c: Hybrid Power Integration
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 1999 - Conference > EPE 1999 - Topic 01: DEVICES > EPE 1999 - Topic 01c: Hybrid Power Integration
	[return to parent folder]

	State of the Art of Integrated Power Modules (IPMs) for 0.75kW an... By J. Flannery; M. Meinhardt; P. Cheasty; P. Byrne; S. Cian O'Mathuna; O. Slattery; K. Briggs; P. Barras; B. Drury	[View] [Download]
Abstract: A review of the state of the art of the packaging aspects of integrated power modules (IPMs) for 0.75 kW and 2 kW industrial motor drive applications is presented from the user's perspective. The power electronic packaging aspects of a number of commercial IPMs were analysed in terms of complexity, electrical and thermal performance, build and manufacturability, all factors, which would influence their use and reliability. Results of thermal simulations are presented which compare the dynamic behaviour of the most common module build options in overload operation. Recent trends on packaging of these types of modules are presented.

	Thyristor Intelligent Power Module (IPM) with Temperature Protection By Z. Lisik; T. Michalski; Z. Szczepaniak; J. Szmidt	[View] [Download]
Abstract: An intelligent power module (IPM) based on bipolar elements is presented. It is a test module with a thyristor AC follow-up switch for group control of AC load. In the IPM, the control and power supply as well as the temperature monitoring and overtemperature protection of semiconductor devices have been integrated. The temperature is measured directly inside the thyristor during its reverse bias, using the forward bias gate-cathode junction as the thermosensor. Operating examination of the test modules has been carried out showns high efficiency of the temperature protection applied to the device. The paper includes the description of the module and the results of the tests.