EPE Association: EPE 2001 - Topic 01f: Thermal Design

EPE 2001 - Topic 01f: Thermal Design
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2001 - Conference > EPE 2001 - Topic 01: DEVICES > EPE 2001 - Topic 01f: Thermal Design

   [return to parent folder]

   A simple analytical approach for the thermal modeling of power devices
By Niccolò Rinaldi [View]
[Download]

Abstract: A new analytical thermal model of multilayer substrates is presented. Based on the integration of the temperature field generated by a point source and on a generalization of the method of images, the model is straightforward to implement and computationally efficient. Approximate expressions for the thermal resistance in multilayer substrates are derived for the first time.

   IGBT Module Thermal Simulation
By M. Janicki; A. Napieralski [View]
[Download]

Abstract: This paper presents results of thermal simulations performed for an IGBT hybrid power module. Two different thermal models of the circuit were proposed. The more complex model is solved numerically using the finite differences method; the other is solved analytically employing the Fourier method. The simulation results are validated with infrared measurements. The discussion on the influence of thermal model simplification on its accuracy is included.

EPE 2001 - Topic 01f: Thermal Design
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2001 - Conference > EPE 2001 - Topic 01: DEVICES > EPE 2001 - Topic 01f: Thermal Design
	[return to parent folder]

	A simple analytical approach for the thermal modeling of power devices By Niccolò Rinaldi	[View] [Download]
Abstract: A new analytical thermal model of multilayer substrates is presented. Based on the integration of the temperature field generated by a point source and on a generalization of the method of images, the model is straightforward to implement and computationally efficient. Approximate expressions for the thermal resistance in multilayer substrates are derived for the first time.

	IGBT Module Thermal Simulation By M. Janicki; A. Napieralski	[View] [Download]
Abstract: This paper presents results of thermal simulations performed for an IGBT hybrid power module. Two different thermal models of the circuit were proposed. The more complex model is solved numerically using the finite differences method; the other is solved analytically employing the Fourier method. The simulation results are validated with infrared measurements. The discussion on the influence of thermal model simplification on its accuracy is included.