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A simple analytical approach for the thermal modeling of power devices
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| Author(s) |
Niccolò Rinaldi |
| Abstract |
A new analytical thermal model of multilayer substrates is presented. Based on the integration of the
temperature field generated by a point source and on a generalization of the method of images, the
model is straightforward to implement and computationally efficient. Approximate expressions for
the thermal resistance in multilayer substrates are derived for the first time. |
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| Filename: | EPE2001 - PP00736 - Rinaldi.pdf |
| Filesize: | 108.6 KB |
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| Type |
Members Only |
| Date |
Last modified 2004-03-09 by System |
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