EPE Association: EPE 2023 - LS2c: Modular Multilevel Converters

EPE 2023 - LS2c: Modular Multilevel Converters
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2023 ECCE Europe - Conference > EPE 2023 - Topic 02: Power Converter Topologies and Design > EPE 2023 - LS2c: Modular Multilevel Converters

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   A 2N+1 MMPC Scheme Without Arm Current Sensors for Medium Voltage MMCs
By Rupam CHAKI, Anubrata DEY [View]
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Abstract: The output current of Modular Multilevel Converter (MMC) with medium voltage grid interface iscontrolled by a 2N+1 Modulated Model Predictive Control (MMPC) scheme with proper delay compensation. The arm current and pole voltage sensors are avoided for a 3-_ MMC by a properly designed State Observer model while controlling the circulating current and submodule capacitor voltages.

   Dynamic Mission Profile Emulation for short-term reliability test of Submodule in Modular Multilevel Converter
By Li ENYI, Ma KE, Zhang YALIN [View]
[Download]

Abstract: For reliability improvements, a concept of test method called Mission Profile Emulation (MPE) has been proposed to recreate realistic loading conditions on Submodules (SMs) of Modular Multilevel Converters (MMCs). However, in most existing MPE, accurate dynamic emulation has not yet been achieved. The inaccuracy of dynamic emulation will result in the short-term reliability test, such as the temporary over-load operating test, cannot be correctly validated. Moreover, without proper dynamic responses, the MMC control strategies cannot be effectively validated as well. In this paper, a dynamic MPE method for SMs in MMC is proposed. In this method, the references for the testing system are accurately generated by a virtual MMC system, and the control bandwidth is widened by combining the MMC system in the control loop of the testing system. Finally, Simulation and experimental validations are given.

   Thermal Design of a Medium Voltage Modular Multilevel Converter Cell
By Yanick FREI, Drazen DUJIC [View]
[Download]

Abstract: This paper presents the cooling concept for a medium voltage modular multilevel converter cell. Tooptimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance.

EPE 2023 - LS2c: Modular Multilevel Converters
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2023 ECCE Europe - Conference > EPE 2023 - Topic 02: Power Converter Topologies and Design > EPE 2023 - LS2c: Modular Multilevel Converters
	[return to parent folder]

	A 2N+1 MMPC Scheme Without Arm Current Sensors for Medium Voltage MMCs By Rupam CHAKI, Anubrata DEY	[View] [Download]
Abstract: The output current of Modular Multilevel Converter (MMC) with medium voltage grid interface iscontrolled by a 2N+1 Modulated Model Predictive Control (MMPC) scheme with proper delay compensation. The arm current and pole voltage sensors are avoided for a 3-_ MMC by a properly designed State Observer model while controlling the circulating current and submodule capacitor voltages.

	Dynamic Mission Profile Emulation for short-term reliability test of Submodule in Modular Multilevel Converter By Li ENYI, Ma KE, Zhang YALIN	[View] [Download]
Abstract: For reliability improvements, a concept of test method called Mission Profile Emulation (MPE) has been proposed to recreate realistic loading conditions on Submodules (SMs) of Modular Multilevel Converters (MMCs). However, in most existing MPE, accurate dynamic emulation has not yet been achieved. The inaccuracy of dynamic emulation will result in the short-term reliability test, such as the temporary over-load operating test, cannot be correctly validated. Moreover, without proper dynamic responses, the MMC control strategies cannot be effectively validated as well. In this paper, a dynamic MPE method for SMs in MMC is proposed. In this method, the references for the testing system are accurately generated by a virtual MMC system, and the control bandwidth is widened by combining the MMC system in the control loop of the testing system. Finally, Simulation and experimental validations are given.

	Thermal Design of a Medium Voltage Modular Multilevel Converter Cell By Yanick FREI, Drazen DUJIC	[View] [Download]
Abstract: This paper presents the cooling concept for a medium voltage modular multilevel converter cell. Tooptimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance.