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Thermal Design of a Medium Voltage Modular Multilevel Converter Cell
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| Author(s) |
Yanick FREI, Drazen DUJIC |
| Abstract |
This paper presents the cooling concept for a medium voltage modular multilevel converter cell. Tooptimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance. |
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| Filename: | 0063-epe2023-full-12232171.pdf |
| Filesize: | 3.539 MB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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