EPE Association: EPE 2015 - LS4b: Power System Integration, packaging & thermal management

EPE 2015 - LS4b: Power System Integration, packaging & thermal management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2015 ECCE Europe - Conference > EPE 2015 - Topic 01: Devices, Packaging and System Integration > EPE 2015 - LS4b: Power System Integration, packaging & thermal management

   [return to parent folder]

   An improved and low-resistive package for high-current power MOSFET
By Ralf WALTER [View]
[Download]

Abstract: Over the years improved silicon technologies for low-voltage power MOSFETs have led to a very low on-resistance of the die which is now comparable or even lower than that of the device package. Modern SMD packages offer a significant reduction of the package-related resistive contribution to the overall on-resistance but are limited in the maximum useable chip size due to their small form factor. Larger dies are usually mounted into through-hole-packages or their derivatives resulting in certain limitations of their performance. In this work a new package solution especially suited for high current applications linked to high reliability requirements such as industrial motor drives or servers is discussed from the user's perspective.

   CMOS Gate Driver with Integrated Optical receiver for Power Electronics applications
By Thanh Long LE [View]
[Download]

Abstract: This paper presents a CMOS gate driver integrating the required functions from the optical control signal receiver to the output stage gate charge control. Different prototypes were designed and fabricated based on the CMOS industrial technologies available through Multi-Project Wafers (0.35µm LV bulk). Integrated optical receivers are used to provide isolated and low parasitics propagation path for the gate control signal. Such detectors exhibit a maximum responsivity above 0.32 A/W and a modulation bandwidth above 10MHz while connected to the integrated signal processing unit. This integrated gate driver requires a low optical power and is drastically improving the dv/dt immunity, parasitics and integration level. The experimental results have validated the functionalities and performances of this gate driver in order to drive a power transistor in a power converter.

   Differential-Mode Oscillations between parallel IGBTs in Power Modules
By Matthias SPANG [View]
[Download]

Abstract: Large IGBT modules often consist of many IGBTs connected in parallel in order to achieve high current ratings. In the ideal case, current is shared equally between these IGBTs. However, in real power modules parasitic oscillations between the IGBTs can occur, which can lead to EMC issues or even damage the power module. In this paper, two different oscillation circuits are presented which have been observed in different power modules. Only self-exciting, differential mode oscillations are treated in this work. Measures to reduce or avoid these oscillations are discussed. As one technique to analyze the properties of the oscillations, the stability of the circuits is analyzed by calculating the poles of linearized networks.

   In-situ Health Monitoring of Power Converter Modules for Preventive Maintenance and Improved Availability
By ATTAHIR ALIYU [View]
[Download]

Abstract: This paper proposes an on-board methodology for monitoring the health of power converter modules in inverters driving inductive loads such as induction motors. The ability to keep regular track of the actual degradation level of the modules enables the adoption of preventive maintenance, reducing or even eliminating altogether the appearance of failures during operation, significantly improving the availability of the equipment. The novelty and originality of the solution proposed here is twofold. First, health monitoring routines are carried out during non-operation phases of the inverter. Secondly, only the circuitry already implemented in the inverter for nominal operation is made use of, without any additional components, apart from an analogue measurement circuit. Degradation is tracked by means of thermal impedance measurements, processed in the form of structure functions for greater resolution and accuracy of information. Vector control is used to supply the heating current from the inverter's DC source, while making sure that the motor load remains at a standstill. The use of vector control gives the advantage of using the existing control software. Experimental results showing the identification of degradation using structure function and thermal transient measurement extracted from the integration of the inverter and measurement circuit are presented in this work.

EPE 2015 - LS4b: Power System Integration, packaging & thermal management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2015 ECCE Europe - Conference > EPE 2015 - Topic 01: Devices, Packaging and System Integration > EPE 2015 - LS4b: Power System Integration, packaging & thermal management
	[return to parent folder]

	An improved and low-resistive package for high-current power MOSFET By Ralf WALTER	[View] [Download]
Abstract: Over the years improved silicon technologies for low-voltage power MOSFETs have led to a very low on-resistance of the die which is now comparable or even lower than that of the device package. Modern SMD packages offer a significant reduction of the package-related resistive contribution to the overall on-resistance but are limited in the maximum useable chip size due to their small form factor. Larger dies are usually mounted into through-hole-packages or their derivatives resulting in certain limitations of their performance. In this work a new package solution especially suited for high current applications linked to high reliability requirements such as industrial motor drives or servers is discussed from the user's perspective.

	CMOS Gate Driver with Integrated Optical receiver for Power Electronics applications By Thanh Long LE	[View] [Download]
Abstract: This paper presents a CMOS gate driver integrating the required functions from the optical control signal receiver to the output stage gate charge control. Different prototypes were designed and fabricated based on the CMOS industrial technologies available through Multi-Project Wafers (0.35µm LV bulk). Integrated optical receivers are used to provide isolated and low parasitics propagation path for the gate control signal. Such detectors exhibit a maximum responsivity above 0.32 A/W and a modulation bandwidth above 10MHz while connected to the integrated signal processing unit. This integrated gate driver requires a low optical power and is drastically improving the dv/dt immunity, parasitics and integration level. The experimental results have validated the functionalities and performances of this gate driver in order to drive a power transistor in a power converter.

	Differential-Mode Oscillations between parallel IGBTs in Power Modules By Matthias SPANG	[View] [Download]
Abstract: Large IGBT modules often consist of many IGBTs connected in parallel in order to achieve high current ratings. In the ideal case, current is shared equally between these IGBTs. However, in real power modules parasitic oscillations between the IGBTs can occur, which can lead to EMC issues or even damage the power module. In this paper, two different oscillation circuits are presented which have been observed in different power modules. Only self-exciting, differential mode oscillations are treated in this work. Measures to reduce or avoid these oscillations are discussed. As one technique to analyze the properties of the oscillations, the stability of the circuits is analyzed by calculating the poles of linearized networks.

	In-situ Health Monitoring of Power Converter Modules for Preventive Maintenance and Improved Availability By ATTAHIR ALIYU	[View] [Download]
Abstract: This paper proposes an on-board methodology for monitoring the health of power converter modules in inverters driving inductive loads such as induction motors. The ability to keep regular track of the actual degradation level of the modules enables the adoption of preventive maintenance, reducing or even eliminating altogether the appearance of failures during operation, significantly improving the availability of the equipment. The novelty and originality of the solution proposed here is twofold. First, health monitoring routines are carried out during non-operation phases of the inverter. Secondly, only the circuitry already implemented in the inverter for nominal operation is made use of, without any additional components, apart from an analogue measurement circuit. Degradation is tracked by means of thermal impedance measurements, processed in the form of structure functions for greater resolution and accuracy of information. Vector control is used to supply the heating current from the inverter's DC source, while making sure that the motor load remains at a standstill. The use of vector control gives the advantage of using the existing control software. Experimental results showing the identification of degradation using structure function and thermal transient measurement extracted from the integration of the inverter and measurement circuit are presented in this work.