EPE Association: EPE 1997 – 09: Lecture Session L3a: HYBRID POWER INTEGRATION

EPE 1997 – 09: Lecture Session L3a: HYBRID POWER INTEGRATION
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 1997 - Conference > EPE 1997 – 09: Lecture Session L3a: HYBRID POWER INTEGRATION

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   EVALUATION AND FUTURE PROSPECTS OF AN INTEGRATION TECHNOLOGY FOR HYBRID MULTIKILOWATT POWER ELECTRONIC CONVERTERS
By J.D. van Wyk; J.A. Ferreira [View]
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Abstract: The integration of converters with capacitive-inductive-transformer components inherent to the design are studied. The subcircuit technologies are investigated and applied to ease studies, of which details are given.

   HIGH SPEED POWER MODULES WITH INTEGRAL LIQUID COOLING
By S. Bontemps; D. Grafham; P. Sable [View]
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Abstract: This paper describes an innovative method for the removal of heat from senliconductor power modules operating at ultra-sonic frequencies. In such applications switching losses are often so high that air cooling is inadequate, and liquid cooling must be used. Traditionally, this is achieved by bolting a standard module onto a liquid-cooled heat exchanger. While more effective than air cooling, a thermal barrier still exists between the module baseplate and separate heatsink, and this contributes significantly to the total junction -to-ambient thermal resistance. To elinlinate this barrier, APT Europe has engineered an integral liquid cooled (ILC) power module package, where the module baseplate doubles as tl1e liquid cooled heat exchanger's upper lid. In this way, the cooling medimn is in direct contact with the module baseplate, and there is no interface. To illustrate the dramatic improvements in performance made possible by this approach, the thermal performance of air and liquid cooled power MOSFET switches, with the same silicon real-estate, is compared. Data is presented to illustrate the influence of flow rate on thermal resistance, and the impact of the choice of baseplate material on long term reliability is also analyzed. The design is such that, in the event of module failure, the heat exchanger portion can be reclaimed for further use.

   NEW ENCAPSULATION TECHNIQUES FOR IMW- l TO 4 kV HIGH POWER IGBT INVERTERS
By E. Ranchy; A. Pétition; J. Gonzalez [View]
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Abstract: This paper describes architectures for liquid-cooled high power integrated converters. Electrical and thermal performances are given for H bridge IPM converter, including in a single package power device, IGBT gate drives and protections and liquid cooling elements. Modular architecture of converters is based on diode and IGBT chips (75-100 A, 1200 or 1600V), serie associated to achieve high voltage operation. Electrical insulation is realised by means of dielectric fluid (oil, freon substitutes) or de-ionized water, resulting in thermal performances enhancement and so high power/volume ratio.

   EVOLUTION OF APPLICATION SPECIFIC IPM
By G. Majumdar; K.H. Hussein; E. Thal; G. Debled; T. Oota; F. Tametani [View]
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Abstract: This paper introduces a new series of Mitsubishi's Application Specific Intelligent Power Modules (ASIPM) targeted at small power AC servo drive applications. The new ASIPM series features a high accuracy built-in analogue current sense function realized by a built-in low-voltage IC (LVIC). The ASIPM integrates the latest technology of power chips necessary for 3 Phi servo operations (IGBTs and free-wheeling diodes) complete with optimized IGBT drive circuitry. With the help of a built-in high-voltage power IC (600V junction isolated HVIC), the ASIPM offers opto-coupler-less and single power source (mono-supply) IGBT gate drive capabilities. The new series is rated at 600 V and covers a current ratings range from 4A up-to 30A. In this paper, detailed description of the new ASIPM design outlines, merits, and technical functionality will be given.

EPE 1997 – 09: Lecture Session L3a: HYBRID POWER INTEGRATION
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 1997 - Conference > EPE 1997 – 09: Lecture Session L3a: HYBRID POWER INTEGRATION
	[return to parent folder]

	EVALUATION AND FUTURE PROSPECTS OF AN INTEGRATION TECHNOLOGY FOR HYBRID MULTIKILOWATT POWER ELECTRONIC CONVERTERS By J.D. van Wyk; J.A. Ferreira	[View] [Download]
Abstract: The integration of converters with capacitive-inductive-transformer components inherent to the design are studied. The subcircuit technologies are investigated and applied to ease studies, of which details are given.

	HIGH SPEED POWER MODULES WITH INTEGRAL LIQUID COOLING By S. Bontemps; D. Grafham; P. Sable	[View] [Download]
Abstract: This paper describes an innovative method for the removal of heat from senliconductor power modules operating at ultra-sonic frequencies. In such applications switching losses are often so high that air cooling is inadequate, and liquid cooling must be used. Traditionally, this is achieved by bolting a standard module onto a liquid-cooled heat exchanger. While more effective than air cooling, a thermal barrier still exists between the module baseplate and separate heatsink, and this contributes significantly to the total junction -to-ambient thermal resistance. To elinlinate this barrier, APT Europe has engineered an integral liquid cooled (ILC) power module package, where the module baseplate doubles as tl1e liquid cooled heat exchanger's upper lid. In this way, the cooling medimn is in direct contact with the module baseplate, and there is no interface. To illustrate the dramatic improvements in performance made possible by this approach, the thermal performance of air and liquid cooled power MOSFET switches, with the same silicon real-estate, is compared. Data is presented to illustrate the influence of flow rate on thermal resistance, and the impact of the choice of baseplate material on long term reliability is also analyzed. The design is such that, in the event of module failure, the heat exchanger portion can be reclaimed for further use.

	NEW ENCAPSULATION TECHNIQUES FOR IMW- l TO 4 kV HIGH POWER IGBT INVERTERS By E. Ranchy; A. Pétition; J. Gonzalez	[View] [Download]
Abstract: This paper describes architectures for liquid-cooled high power integrated converters. Electrical and thermal performances are given for H bridge IPM converter, including in a single package power device, IGBT gate drives and protections and liquid cooling elements. Modular architecture of converters is based on diode and IGBT chips (75-100 A, 1200 or 1600V), serie associated to achieve high voltage operation. Electrical insulation is realised by means of dielectric fluid (oil, freon substitutes) or de-ionized water, resulting in thermal performances enhancement and so high power/volume ratio.

	EVOLUTION OF APPLICATION SPECIFIC IPM By G. Majumdar; K.H. Hussein; E. Thal; G. Debled; T. Oota; F. Tametani	[View] [Download]
Abstract: This paper introduces a new series of Mitsubishi's Application Specific Intelligent Power Modules (ASIPM) targeted at small power AC servo drive applications. The new ASIPM series features a high accuracy built-in analogue current sense function realized by a built-in low-voltage IC (LVIC). The ASIPM integrates the latest technology of power chips necessary for 3 Phi servo operations (IGBTs and free-wheeling diodes) complete with optimized IGBT drive circuitry. With the help of a built-in high-voltage power IC (600V junction isolated HVIC), the ASIPM offers opto-coupler-less and single power source (mono-supply) IGBT gate drive capabilities. The new series is rated at 600 V and covers a current ratings range from 4A up-to 30A. In this paper, detailed description of the new ASIPM design outlines, merits, and technical functionality will be given.