| Abstract |
This paper describes architectures for liquid-cooled high power integrated converters. Electrical and thermal performances are given for H bridge IPM converter, including in a single package power device, IGBT gate drives and protections and liquid cooling elements. Modular architecture of converters is based on diode and IGBT chips (75-100 A, 1200 or 1600V), serie associated to achieve high voltage operation. Electrical insulation is realised by means of dielectric fluid (oil, freon substitutes) or de-ionized water, resulting in thermal performances enhancement and so high power/volume ratio. |
