EPE Association: EPE 2011 - LS6c: Topic 02: Passive Components, System Integration & Packaging

EPE 2011 - LS6c: Topic 02: Passive Components, System Integration & Packaging
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2011 ECCE Europe - Conference > EPE 2011 - Topic 02: Passive Components, System Integration & Packaging > EPE 2011 - LS6c: Topic 02: Passive Components, System Integration & Packaging

   [return to parent folder]

   Adaptive cooling of power modules for reduced power and thermal cycling
By Wei Juin CHOY, Alberto CASTELLAZZI, Pericle ZANCHETTA [View]
[Download]

Abstract: This work proposes a cooling strategy which responds to changes both in the power dissipation and in the base-plate or heat-sink temperature of power devices and modifies the system thermal impedance accordingly. That allows to reduce both the amplitude of power cycles (i.e., active cycles, due to self-heating effects) and of thermal cycles (i.e., passive cycles, due to changes in ambient temperature), yielding lesser thermo-mechanical stresses and improved system performance and reliability. This paper considers the particular case of forced-convection air-cooling and provides proof-of-concept experimental demonstration of the approach. Though not yet optimised, the potentiality of the proposed cooling strategy is well demonstrated.

   High-Temperature Die-Attaches for SiC Power Devices
By Amandine MASSON, Cyril BUTTAY, Herve MOREL, Christophe RAYNAUD, Stanislas HASCOET, Laurent GREMILLARD [View]
[Download]

Abstract: SiC devices have been substituted to Si dies for high temperature applications. However, classical packagings are not adapted for harsh environment and new solutions for back-side die attach must be envisaged. In this paper, theoretical basis and results for nano-silver sintering Transient Liquid Phase Bonding will be presented.

   Integrated Current Balancing Transformer for Primary Parallel Isolated Boost Converter
By Gokhan SEN, Ziwei OUYANG, Michael A. E. ANDERSEN, Ole C. THOMSEN, Lars MOLLER [View]
[Download]

Abstract: A simple, PCB compatible integrated solution is proposed for the current balancing requirement of the primary parallel isolated boost converter (PPIBC). Input inductor and the current balancing transformer are merged into the same core, which reduces the number of components allowing a cheaper and more compact solution. Gyrator-Capacitor modeling technique has been used, providing an easy way for understanding integrated magnetic structures. Proposed idea has been verified by simulation and experimental results.

EPE 2011 - LS6c: Topic 02: Passive Components, System Integration & Packaging
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2011 ECCE Europe - Conference > EPE 2011 - Topic 02: Passive Components, System Integration & Packaging > EPE 2011 - LS6c: Topic 02: Passive Components, System Integration & Packaging
	[return to parent folder]

	Adaptive cooling of power modules for reduced power and thermal cycling By Wei Juin CHOY, Alberto CASTELLAZZI, Pericle ZANCHETTA	[View] [Download]
Abstract: This work proposes a cooling strategy which responds to changes both in the power dissipation and in the base-plate or heat-sink temperature of power devices and modifies the system thermal impedance accordingly. That allows to reduce both the amplitude of power cycles (i.e., active cycles, due to self-heating effects) and of thermal cycles (i.e., passive cycles, due to changes in ambient temperature), yielding lesser thermo-mechanical stresses and improved system performance and reliability. This paper considers the particular case of forced-convection air-cooling and provides proof-of-concept experimental demonstration of the approach. Though not yet optimised, the potentiality of the proposed cooling strategy is well demonstrated.

	High-Temperature Die-Attaches for SiC Power Devices By Amandine MASSON, Cyril BUTTAY, Herve MOREL, Christophe RAYNAUD, Stanislas HASCOET, Laurent GREMILLARD	[View] [Download]
Abstract: SiC devices have been substituted to Si dies for high temperature applications. However, classical packagings are not adapted for harsh environment and new solutions for back-side die attach must be envisaged. In this paper, theoretical basis and results for nano-silver sintering Transient Liquid Phase Bonding will be presented.

	Integrated Current Balancing Transformer for Primary Parallel Isolated Boost Converter By Gokhan SEN, Ziwei OUYANG, Michael A. E. ANDERSEN, Ole C. THOMSEN, Lars MOLLER	[View] [Download]
Abstract: A simple, PCB compatible integrated solution is proposed for the current balancing requirement of the primary parallel isolated boost converter (PPIBC). Input inductor and the current balancing transformer are merged into the same core, which reduces the number of components allowing a cheaper and more compact solution. Gyrator-Capacitor modeling technique has been used, providing an easy way for understanding integrated magnetic structures. Proposed idea has been verified by simulation and experimental results.