EPE Association: EPE 2005 - Topic 02-1

EPE 2005 - Topic 02-1 - LS: System Integration
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2005 - Conference > EPE 2005 - Topic 02: PASSIVE COMPONENTS, SYSTEM INTEGRATION & PACKAGING > EPE 2005 - Topic 02-1 - LS: System Integration

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   Super Cooling Structures for Power Electronics
By LISIK Zbigniew; RAJ Ewa; RUDZKI Jacek; LANGER Malgorzata [View]
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Abstract: The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1K/W.

   System Integration in Automotive Power Systems
By MAeRZ Martin; GERBER Mark [View]
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Abstract: System integration is becoming ever more important in the design and implementation of power electronics. In this paper, system integration is considered and a definition is presented. Based on the definition, the interdependence of the electrical, the thermal and the spatial design of a system are considered and identified. These interdependencies provide the means to manipulate a system design so that all the specifications (electrical, thermal and spatial) can be satisfied simultaneously by the system. Two case studies, both automotive in nature are presented to illustrate the system integration concept. The first is an Integrated System Module implementing a high power density 14V/42V DC/DC converter and the second is an integrated drive for hybrid vehicles, both implemented with high temperature cooling. Practical results are presented.

   Towards a roadmap for power electronics system integration
By VAN WYK Daan; FERREIRA Braham; OMATHUNA Sean Cian [View]
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Abstract: Conventional construction technology for electronic power supplies, based on theassembly of pre-manufactured discrete components, has matured to such an extentthat it has become very difficult to reduce unit costs and enhance the power density further. The manufacturers of electronic circuit components such as capacitors, resistors and wire-wound magnetics are operating at very small profit margins. The situation for manufacturers of control IC’s and power semiconductor devices is better, however margins still restrict R&D budgets. As a result, the technologies are driven deeper into maturity and fractions of a cent become important when the profit margin is calculated. Everybody has to play by the same rules and it becomes increasingly difficult for power supply manufacturers to achieve a competitive edge.

EPE 2005 - Topic 02-1 - LS: System Integration
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2005 - Conference > EPE 2005 - Topic 02: PASSIVE COMPONENTS, SYSTEM INTEGRATION & PACKAGING > EPE 2005 - Topic 02-1 - LS: System Integration
	[return to parent folder]

	Super Cooling Structures for Power Electronics By LISIK Zbigniew; RAJ Ewa; RUDZKI Jacek; LANGER Malgorzata	[View] [Download]
Abstract: The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1K/W.

	System Integration in Automotive Power Systems By MAeRZ Martin; GERBER Mark	[View] [Download]
Abstract: System integration is becoming ever more important in the design and implementation of power electronics. In this paper, system integration is considered and a definition is presented. Based on the definition, the interdependence of the electrical, the thermal and the spatial design of a system are considered and identified. These interdependencies provide the means to manipulate a system design so that all the specifications (electrical, thermal and spatial) can be satisfied simultaneously by the system. Two case studies, both automotive in nature are presented to illustrate the system integration concept. The first is an Integrated System Module implementing a high power density 14V/42V DC/DC converter and the second is an integrated drive for hybrid vehicles, both implemented with high temperature cooling. Practical results are presented.

	Towards a roadmap for power electronics system integration By VAN WYK Daan; FERREIRA Braham; OMATHUNA Sean Cian	[View] [Download]
Abstract: Conventional construction technology for electronic power supplies, based on theassembly of pre-manufactured discrete components, has matured to such an extentthat it has become very difficult to reduce unit costs and enhance the power density further. The manufacturers of electronic circuit components such as capacitors, resistors and wire-wound magnetics are operating at very small profit margins. The situation for manufacturers of control IC’s and power semiconductor devices is better, however margins still restrict R&D budgets. As a result, the technologies are driven deeper into maturity and fractions of a cent become important when the profit margin is calculated. Everybody has to play by the same rules and it becomes increasingly difficult for power supply manufacturers to achieve a competitive edge.