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   Super Cooling Structures for Power Electronics   [View] 
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 Author(s)   LISIK Zbigniew; RAJ Ewa; RUDZKI Jacek; LANGER Malgorzata 
 Abstract   The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1K/W.  
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Filename:0314
Filesize:301.1 KB
 Type   Members Only 
 Date   Last modified 2006-02-05 by System