EPE 2025 - Topic 07: Semiconductor Devices and Packaging
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	EPE 2025 - DS1k: Active Devices and Components
In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Active Devices and Components
	EPE 2025 - DS1l: Integration and Packaging
In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Integration and Packaging
	EPE 2025 - DS1m: Cooling Circuits and Thermal Management
In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Cooling Circuits and Thermal Management
	EPE 2025 - DS1n: Reliability and Life-Cycle Assessment
In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Reliability and Life-Cycle Assessment
	EPE 2025 - LS1d: Active devices
In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Active devices
	EPE 2025 - LS2d: Reliability & Systems & Packaging
In this category, you will find the papers presented at the EPE '25 Conference, which took place in Paris, France, during the session Reliability & Systems & Packaging