EPE 2003 - Topic 02d: Integration of FEA and Lumped Parameter Methods | ||
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2003 - Conference > EPE 2003 - Topic 02: POWER ELECTRONIC SYSTEM DESIGN & PACKAGING > EPE 2003 - Topic 02d: Integration of FEA and Lumped Parameter Methods | ||
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![]() | Power integration: electrical analysis of new emerging package
By C. Martin; J-L. Schanen; E.Clavel; R. Pasterczyk | |
Abstract: The paper presents detailed electrical analysis of a new power electronics package. Generic
electrical equivalent scheme is deduced from PEEC approach. Automatic coupling with SaberĀ® allows
complete simulation. Analysis of current sharing and surges between all IGBTs and diodes dies has been
achieved, as well as all possible interactions among power to power and power to drive circuits.
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