EPE Association: EPE 2020 - LS1b: Components' Reliability

EPE 2020 - LS1b: Components' Reliability
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2020 ECCE Europe - Conference > EPE 2020 - Topic 01: Devices, Packaging and System Integration > EPE 2020 - LS1b: Components' Reliability

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   Impact of Combined Thermo-Mechanical and Electro-Chemical Stress on the Lifetime of Power Electronic Devices
By Felix HOFFMANN [View]
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Abstract: In this work, the impact of previous thermo-mechanical stress on the humidity ruggedness of IGBTs was investigated. For this purpose, a combined power cycling test (PCT) and high humidity, high temperature, reverse bias (H3TRB) reliability test was performed. In order to quantify a possible impact based on the amount of previous stress, devices of different health conditions were used. Some devices were subject to power cycling for 50 \% of their estimated cycles to failure before being tested in an H3TRB test. Other devices were preconditioned in power cycling until the end of life criterion was reached before they were subject to the H3TRB test. The results of this work indicate that previous thermo-mechanical stress does have an impact on the H3TRB performance of at least some of the tested devices. Furthermore, the test results do not clearly indicate a significant difference between the devices, which were preconditioned with 50 \% of their cycles to failure and the devices, which were subject to power cycling until end of life.

   Packaging Technology for the Improvement of Power Cycling Capability of HVIGBTs
By Kenji HATORI [View]
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Abstract: Power cycling capability is one of the major reliability topics of IGBT modules. Therefore, the packaging technology for the improvement of power cycling capability is described in the paper. Bond-wire lift off, due to the mismatch between silicon (Si) and aluminum (Al) bond wire, is well-known failure root cause of power-cycling fatigue. Therefore, the improved bond wire technology was introduced. However, it is not enough just to improve wire bonding technology because increased operating temperature brings additional stress on other materials. In addition to bond wire technology, three components and their impact are described in this paper: silicone gel material, solder material and metallization material of the ceramic. Finally, the improvement with the combination of all established technologies is confirmed.

   Validity of power cycling lifetime models for modules and extension to low temperature swings
By Josef LUTZ [View]
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Abstract: Various papers in power electronics contain a part of lifetime estimation depending on power cycles inapplication. The used model is often the CIPS08 lifetime model published at the conference CIPS 2008.In many applications, a lot of cycles with low temperature swings occur. The used model, however, isonly valid for temperature swings above 40 K. For temperature swings inf. 30 K, there are strongdeviations, since some materials are now approaching the elastic region. First experimental powercycling results are gained below 30 K temperature swing. Also an approximation for the reliability oflow temperature swing is given in this paper.

EPE 2020 - LS1b: Components' Reliability
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2020 ECCE Europe - Conference > EPE 2020 - Topic 01: Devices, Packaging and System Integration > EPE 2020 - LS1b: Components' Reliability
	[return to parent folder]

	Impact of Combined Thermo-Mechanical and Electro-Chemical Stress on the Lifetime of Power Electronic Devices By Felix HOFFMANN	[View] [Download]
Abstract: In this work, the impact of previous thermo-mechanical stress on the humidity ruggedness of IGBTs was investigated. For this purpose, a combined power cycling test (PCT) and high humidity, high temperature, reverse bias (H3TRB) reliability test was performed. In order to quantify a possible impact based on the amount of previous stress, devices of different health conditions were used. Some devices were subject to power cycling for 50 \% of their estimated cycles to failure before being tested in an H3TRB test. Other devices were preconditioned in power cycling until the end of life criterion was reached before they were subject to the H3TRB test. The results of this work indicate that previous thermo-mechanical stress does have an impact on the H3TRB performance of at least some of the tested devices. Furthermore, the test results do not clearly indicate a significant difference between the devices, which were preconditioned with 50 \% of their cycles to failure and the devices, which were subject to power cycling until end of life.

	Packaging Technology for the Improvement of Power Cycling Capability of HVIGBTs By Kenji HATORI	[View] [Download]
Abstract: Power cycling capability is one of the major reliability topics of IGBT modules. Therefore, the packaging technology for the improvement of power cycling capability is described in the paper. Bond-wire lift off, due to the mismatch between silicon (Si) and aluminum (Al) bond wire, is well-known failure root cause of power-cycling fatigue. Therefore, the improved bond wire technology was introduced. However, it is not enough just to improve wire bonding technology because increased operating temperature brings additional stress on other materials. In addition to bond wire technology, three components and their impact are described in this paper: silicone gel material, solder material and metallization material of the ceramic. Finally, the improvement with the combination of all established technologies is confirmed.

	Validity of power cycling lifetime models for modules and extension to low temperature swings By Josef LUTZ	[View] [Download]
Abstract: Various papers in power electronics contain a part of lifetime estimation depending on power cycles inapplication. The used model is often the CIPS08 lifetime model published at the conference CIPS 2008.In many applications, a lot of cycles with low temperature swings occur. The used model, however, isonly valid for temperature swings above 40 K. For temperature swings inf. 30 K, there are strongdeviations, since some materials are now approaching the elastic region. First experimental powercycling results are gained below 30 K temperature swing. Also an approximation for the reliability oflow temperature swing is given in this paper.