EPE Association: EPE 2017 - LS6d: Reliability

EPE 2017 - LS6d: Reliability
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2017 ECCE Europe - Conference > EPE 2017 - Topic 01: Devices, Packaging and System Integration > EPE 2017 - LS6d: Reliability

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   A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles
By Mouhannad DBEISS [View]
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Abstract: This paper presents a new method for the accelerated ageing tests of photovoltaic inverters, created by analyzing the mission profiles of the current and ambient temperature extracted over several years from multiple photovoltaic plants located in France. It is proposed to create a particular ageing profile which takes into account not only the different constraints of the application of the photovoltaic inverters (high-frequency switching and sinusoidal-shaped current), but also reproduces a typical profile of the output current of photovoltaic inverters. Similarly, thermal cycling is applied simultaneously by varying the ambient temperature as in the real application, and by applying current injections with relatively long durations, which will lead to a rise in the temperatures of the DBC substrates and the coolers. This method should show better representation of the thermal behavior of DC/AC inverters used in photovoltaic applications, and is expected to give results that are more representative than traditional power cycling, and thus reducing the favoring of certain failure modes to the detriment of others.

   Humidity Testing of SiC Power MOSFETs - An Update
By Diane-Perle SADIK [View]
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Abstract: The effect of humidity on SiC Power MOSFET modules is investigated in an industrial application. Four modules are operated outdoor and four modules are operated indoor in identical setups, while their breakdown voltages are monitored regularly. The evolution of the leakage current, indicating humidity-induced degradation is observed.

   Mission Profile Emulator for the Power Electronic Systems of Motor Drive Applications
By Ionut VERNICA [View]
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Abstract: Due to the adverse temperature swings which normally occur in the power semiconductor devices during the start-up and deceleration periods of the motor drive system, the thermal design and control, as well as the reliability analysis of the power devices becomes crucial. In order to facilitate testing and access the loading and lifetime performances, a novel stress emulator for power semiconductor devices based on the mission profile of a motor drive system is proposed and designed. The control algorithm for the stress emulator setup is introduced, and the issues concerning the Orthogonal Signal Generator (OSG) are addressed by means of adaptive Notch filter implementation. Finally, experimental results are provided in order to validate the effectiveness of the proposed emulation technique.

   Power cycling test with power generated by an adjustable part of switching losses
By Peter SEIDEL [View]
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Abstract: In standard power cycling tests, forward conduction generates heat in the die and therefore the thermomechanical stress in the package. In application, however, a significant part of the power losses are switching losses, so that the load current is lower than in standard power cy-cling test, for an equal temperature swing. A new concept for power cycling tests is presented, which allows the generation of switching losses in addition to conduction losses. This concept closer to the real application. The circuit still uses a low voltage power source, while maintaining an accurate measurement of the virtual junction temperature. First test results of IGBTs in stand-ard module technology and SiC MOSFETs in discrete TO-247 housing indicate no significant difference in results from standard power cycling tests. The new method was successfully ap-plied to low voltage Si MOSFETs, which is for the first time applied to such a power cycling test under conditions where switching losses dominate.

EPE 2017 - LS6d: Reliability
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2017 ECCE Europe - Conference > EPE 2017 - Topic 01: Devices, Packaging and System Integration > EPE 2017 - LS6d: Reliability
	[return to parent folder]

	A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles By Mouhannad DBEISS	[View] [Download]
Abstract: This paper presents a new method for the accelerated ageing tests of photovoltaic inverters, created by analyzing the mission profiles of the current and ambient temperature extracted over several years from multiple photovoltaic plants located in France. It is proposed to create a particular ageing profile which takes into account not only the different constraints of the application of the photovoltaic inverters (high-frequency switching and sinusoidal-shaped current), but also reproduces a typical profile of the output current of photovoltaic inverters. Similarly, thermal cycling is applied simultaneously by varying the ambient temperature as in the real application, and by applying current injections with relatively long durations, which will lead to a rise in the temperatures of the DBC substrates and the coolers. This method should show better representation of the thermal behavior of DC/AC inverters used in photovoltaic applications, and is expected to give results that are more representative than traditional power cycling, and thus reducing the favoring of certain failure modes to the detriment of others.

	Humidity Testing of SiC Power MOSFETs - An Update By Diane-Perle SADIK	[View] [Download]
Abstract: The effect of humidity on SiC Power MOSFET modules is investigated in an industrial application. Four modules are operated outdoor and four modules are operated indoor in identical setups, while their breakdown voltages are monitored regularly. The evolution of the leakage current, indicating humidity-induced degradation is observed.

	Mission Profile Emulator for the Power Electronic Systems of Motor Drive Applications By Ionut VERNICA	[View] [Download]
Abstract: Due to the adverse temperature swings which normally occur in the power semiconductor devices during the start-up and deceleration periods of the motor drive system, the thermal design and control, as well as the reliability analysis of the power devices becomes crucial. In order to facilitate testing and access the loading and lifetime performances, a novel stress emulator for power semiconductor devices based on the mission profile of a motor drive system is proposed and designed. The control algorithm for the stress emulator setup is introduced, and the issues concerning the Orthogonal Signal Generator (OSG) are addressed by means of adaptive Notch filter implementation. Finally, experimental results are provided in order to validate the effectiveness of the proposed emulation technique.

	Power cycling test with power generated by an adjustable part of switching losses By Peter SEIDEL	[View] [Download]
Abstract: In standard power cycling tests, forward conduction generates heat in the die and therefore the thermomechanical stress in the package. In application, however, a significant part of the power losses are switching losses, so that the load current is lower than in standard power cy-cling test, for an equal temperature swing. A new concept for power cycling tests is presented, which allows the generation of switching losses in addition to conduction losses. This concept closer to the real application. The circuit still uses a low voltage power source, while maintaining an accurate measurement of the virtual junction temperature. First test results of IGBTs in stand-ard module technology and SiC MOSFETs in discrete TO-247 housing indicate no significant difference in results from standard power cycling tests. The new method was successfully ap-plied to low voltage Si MOSFETs, which is for the first time applied to such a power cycling test under conditions where switching losses dominate.