EPE Association: EPE 2011 - LS5c: Topic 02: Cooling, Thermal Design, Thermal Management

EPE 2011 - LS5c: Topic 02: Cooling, Thermal Design, Thermal Management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2011 ECCE Europe - Conference > EPE 2011 - Topic 02: Passive Components, System Integration & Packaging > EPE 2011 - LS5c: Topic 02: Cooling, Thermal Design, Thermal Management

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   Assessment of Power Electronic Inverter Cooling Requirements for a Rear-Axle Drive
By Jonas OTTOSSON, Per KARLSSON [View]
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Abstract: The work presented in this paper is focused on determining the cooling requirement and its effect onthe reliability of a power electronic inverter used in a rear-axle drive for a hybrid car. The coolingrequirements are determined through electro-thermal simulations. Several comparative electro-thermalsimulations are carried out for different levels of cooling, i.e. convection coefficients, power moduleintegration and mission profiles. The importance of taking the thermal coupling, between deviceswithin the power module, into account is discussed. The results obtained from the electro-thermalsimulations are used to estimate how the reliability is affected by the cooling requirements. Twodifferent reliability models are used to estimate the accumulated device damage.

   Study of thermal interfaces aging for power electronics applications
By Jean-Pierre OUSTEN, Zoubir KHATIR [View]
[Download]

Abstract: This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone 1500 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30\% decrease of initial thermal resistance.

   Thermal modeling of the module integrated DC-DC converter for flexible thin-film PV modules
By Milos ACANSKI, Braham FERREIRA, Jelena POPOVIC-GERBER [View]
[Download]

Abstract: Recently there is a trend in PV systems toward a more granular processing of the PV array power by means of distributed maximum power point tracking (DMPPT). This is achieved by connecting a DC-DC converter to each PV module in a PV system and thus performing power processing on a module level as opposed to centralized power processing in traditional PV system architectures. In order to decrease the manufacturing costs and to improve the level of integration, the converter can be directly integrated into the PV module. This on the other hand brings tight thermal coupling between the PV module and the integrated converter and introduces additional heat to the PV module which may deteriorate its performance. It is therefore important to model the thermal behavior of the system in order to estimate reached temperatures and to test the effectiveness of different converter thermal management strategies. This paper presents an investigation into the thermal behavior of a DC-DC converter integrated into a flexible PV module. The goal of this work is to develop analytical thermal models of the PV module and the integrated converter that will allow to quickly predict the reached system temperatures for a set of PV module and converter specifications and boundary conditions. Finally, the results obtained from the developed thermal models show satisfying accuracy when compared to the experimental results and the results obtained using computational fluid dynamics (CFD) simulations.

EPE 2011 - LS5c: Topic 02: Cooling, Thermal Design, Thermal Management
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2011 ECCE Europe - Conference > EPE 2011 - Topic 02: Passive Components, System Integration & Packaging > EPE 2011 - LS5c: Topic 02: Cooling, Thermal Design, Thermal Management
	[return to parent folder]

	Assessment of Power Electronic Inverter Cooling Requirements for a Rear-Axle Drive By Jonas OTTOSSON, Per KARLSSON	[View] [Download]
Abstract: The work presented in this paper is focused on determining the cooling requirement and its effect onthe reliability of a power electronic inverter used in a rear-axle drive for a hybrid car. The coolingrequirements are determined through electro-thermal simulations. Several comparative electro-thermalsimulations are carried out for different levels of cooling, i.e. convection coefficients, power moduleintegration and mission profiles. The importance of taking the thermal coupling, between deviceswithin the power module, into account is discussed. The results obtained from the electro-thermalsimulations are used to estimate how the reliability is affected by the cooling requirements. Twodifferent reliability models are used to estimate the accumulated device damage.

	Study of thermal interfaces aging for power electronics applications By Jean-Pierre OUSTEN, Zoubir KHATIR	[View] [Download]
Abstract: This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator. Several TIM materials (change phase, graphite and polymer based) have undergone 1500 of such cycles. As a result, only the phase change material thermal interface has been affected with a 30\% decrease of initial thermal resistance.

	Thermal modeling of the module integrated DC-DC converter for flexible thin-film PV modules By Milos ACANSKI, Braham FERREIRA, Jelena POPOVIC-GERBER	[View] [Download]
Abstract: Recently there is a trend in PV systems toward a more granular processing of the PV array power by means of distributed maximum power point tracking (DMPPT). This is achieved by connecting a DC-DC converter to each PV module in a PV system and thus performing power processing on a module level as opposed to centralized power processing in traditional PV system architectures. In order to decrease the manufacturing costs and to improve the level of integration, the converter can be directly integrated into the PV module. This on the other hand brings tight thermal coupling between the PV module and the integrated converter and introduces additional heat to the PV module which may deteriorate its performance. It is therefore important to model the thermal behavior of the system in order to estimate reached temperatures and to test the effectiveness of different converter thermal management strategies. This paper presents an investigation into the thermal behavior of a DC-DC converter integrated into a flexible PV module. The goal of this work is to develop analytical thermal models of the PV module and the integrated converter that will allow to quickly predict the reached system temperatures for a set of PV module and converter specifications and boundary conditions. Finally, the results obtained from the developed thermal models show satisfying accuracy when compared to the experimental results and the results obtained using computational fluid dynamics (CFD) simulations.