EPE Association: EPE 2005 - Topic 02-2 - LS: Integrated design methodologies

EPE 2005 - Topic 02-2 - LS: Integrated design methodologies
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2005 - Conference > EPE 2005 - Topic 02: PASSIVE COMPONENTS, SYSTEM INTEGRATION & PACKAGING > EPE 2005 - Topic 02-2 - LS: Integrated design methodologies

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   Analysis of the dynamic Characteristics of a Power Semiconductor Module,　Considering the Influence of Electromagnetic Coupling Between Wiring
By USUI Osamu [View]
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Abstract: The dynamic characteristics of power semiconductor modules were investigated. The switching behavior of power modules is strongly influenced by electromagnetic coupling. Therefore to design highly reliable power modules, it is important to establish a method of analyzing their dynamic characteristics which considers these electromagnetic phenomena. The parasitic parameters of wiring in a power semiconductor module were determined using three-dimensional electromagnetic field analysis and their dynamic characteristics were analyzed using these parameters. The analysis results showed good agreement with the experimental results.

   Double-Sided Low-Temperature Joining Technique for Power Cycling Capability at High Temperature
By AMRO Raed; RUDZKI Jacek; LUTZ Josef; LINDEMANN Andreas; THOBEN Markus [View]
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Abstract: There is a demand for higher junction temperatures in power devices, but the existing packaging technology is limiting the power cycling capability if the junction temperature is increased. Limiting factors are solder interconnections and bond wires. With Replacing the chip-substrate soldering by low temperature joining technique, the power cycling capability of power modules can be increased widely. Replacing also the bond wires and using a double-sided low temperature joining technique, a further significant increase in the life-time of power devices is achieved.

   Optimized Size Design of Integrated Magnetic Components using Area Product Approach
By FROEHLEKE Norbert; NJIENDE Hugues Douglas; BOeCKER Joachim [View]
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Abstract: Substantial reductions in size and costs of magnetic components and power supplies can be achieved by an integration of magnetic components on one core. So far, no adequate method is known for computerized design of integrated magnetics. In this contribution, an optimized size design approach of integrated magnetic components using area product formulation is presented. In a first step, optimal flux density and area product values are determined for discrete multiple-winding inductors and transformers. Using these results in a second step, optimal area products are calculated for integrated magnetic components, consisting of e.g. transformer and either resonant or filter inductor.

   Single chip implementation of the frequency converter controller using FPGA circuit and soft processor
By LUUKKO Julius; PENTTINEN Aki; LAAKKONEN Ossi; PYRHOeNEN Olli [View]
[Download]

Abstract: Modern frequency converters use ASIC circuits to handle fastest operations and microprocessors for slower operations. By using FPGA circuit it is possible to implement a powerful microcontroller inside the FPGA circuit and replace the combination of ASIC and microprocessor with a single chip solution. The FPGA implementation allows more flexible modification of used algorithms and control methods.

EPE 2005 - Topic 02-2 - LS: Integrated design methodologies
You are here: EPE Documents > 01 - EPE & EPE ECCE Conference Proceedings > EPE 2005 - Conference > EPE 2005 - Topic 02: PASSIVE COMPONENTS, SYSTEM INTEGRATION & PACKAGING > EPE 2005 - Topic 02-2 - LS: Integrated design methodologies
	[return to parent folder]

	Analysis of the dynamic Characteristics of a Power Semiconductor Module,　Considering the Influence of Electromagnetic Coupling Between Wiring By USUI Osamu	[View] [Download]
Abstract: The dynamic characteristics of power semiconductor modules were investigated. The switching behavior of power modules is strongly influenced by electromagnetic coupling. Therefore to design highly reliable power modules, it is important to establish a method of analyzing their dynamic characteristics which considers these electromagnetic phenomena. The parasitic parameters of wiring in a power semiconductor module were determined using three-dimensional electromagnetic field analysis and their dynamic characteristics were analyzed using these parameters. The analysis results showed good agreement with the experimental results.

	Double-Sided Low-Temperature Joining Technique for Power Cycling Capability at High Temperature By AMRO Raed; RUDZKI Jacek; LUTZ Josef; LINDEMANN Andreas; THOBEN Markus	[View] [Download]
Abstract: There is a demand for higher junction temperatures in power devices, but the existing packaging technology is limiting the power cycling capability if the junction temperature is increased. Limiting factors are solder interconnections and bond wires. With Replacing the chip-substrate soldering by low temperature joining technique, the power cycling capability of power modules can be increased widely. Replacing also the bond wires and using a double-sided low temperature joining technique, a further significant increase in the life-time of power devices is achieved.

	Optimized Size Design of Integrated Magnetic Components using Area Product Approach By FROEHLEKE Norbert; NJIENDE Hugues Douglas; BOeCKER Joachim	[View] [Download]
Abstract: Substantial reductions in size and costs of magnetic components and power supplies can be achieved by an integration of magnetic components on one core. So far, no adequate method is known for computerized design of integrated magnetics. In this contribution, an optimized size design approach of integrated magnetic components using area product formulation is presented. In a first step, optimal flux density and area product values are determined for discrete multiple-winding inductors and transformers. Using these results in a second step, optimal area products are calculated for integrated magnetic components, consisting of e.g. transformer and either resonant or filter inductor.

	Single chip implementation of the frequency converter controller using FPGA circuit and soft processor By LUUKKO Julius; PENTTINEN Aki; LAAKKONEN Ossi; PYRHOeNEN Olli	[View] [Download]
Abstract: Modern frequency converters use ASIC circuits to handle fastest operations and microprocessors for slower operations. By using FPGA circuit it is possible to implement a powerful microcontroller inside the FPGA circuit and replace the combination of ASIC and microprocessor with a single chip solution. The FPGA implementation allows more flexible modification of used algorithms and control methods.