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Advanced Composite Materials with Tailored Thermal Properties for Heat Sink Applications
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| Author(s) |
NEUBAUER Erich |
| Abstract |
Materials which are used as heat sinks should have a high thermal conductivity combined with a low coefficient of thermal expansion (CTE). Future electronic components will require heat sink materials with thermal conductivities above 300 W/mK and adapted CTEs which can be realized by diamond based composites. Aluminum and Copper-Diamond Composites have been manufactured by a powder metallurgical process. Surface coated diamonds or copper alloys have been used to prepare composites which are characterized by a stable thermal and mechanical interface. This was confirmed by measurement of thermal properties before and after thermal cycling. The used manufacturing process is a cost efficient technique which also allows to some degree the freedom for manufacturing of near net shape parts or composite parts with a high surface quality. |
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| Filename: | 0947-epe2007-full-18330018.pdf |
| Filesize: | 798.9 KB |
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| Type |
Members Only |
| Date |
Last modified 2008-01-11 by System |
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