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Power Cycling Induced Failure Mechanisms in Solder Layers
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| Author(s) |
BAYERER Reinhold; HERRMANN Tobias; LUTZ Josef |
| Abstract |
Improvements of power module technologies are investigated in different life time tests. Failure causes like solder fatigue become more important and a limiting factor for lifetime in power cycling tests. Different failure modes of solder joints in relation to power cycling conditions are shown. |
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| Filename: | 0800-epe2007-full-12075734.pdf |
| Filesize: | 319.5 KB |
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| Type |
Members Only |
| Date |
Last modified 2008-01-11 by System |
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