| Abstract |
Hermetic packaging is a requirement for all applications where electronic components must be protected from corrosive environments to ensure acceptable service life. Extremely high reliability is required for space and military electronics, often utilizing hermetic packages. Metal packages with glass to metal seals are the common solution for low to medium power levels. For high power applications, high current has to be carried and high heat losses to be dissipated. Due to poor thermal conductivity and limited electric conductivity of metals used in standard hermetic packages, direct bond copper solutions have been developed. |
