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Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT module.
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| Author(s) |
DUPONT Laurent; KHATIR Zoubir; BOUARROUDJ Mounira; OUSTEN Jean-Pierre; BADEL Frederic; LEFEBVRE Stephane |
| Abstract |
The paper presents experimental investigations on both power and thermal cycling conditions on 600V-200A six-pack IGBT power modules. Both types of cycles are compared in term of thermo-mechanical stresses by using Finite Element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications. |
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| Filename: | 0405-epe2007-full-13383054.pdf |
| Filesize: | 1.043 MB |
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| Type |
Members Only |
| Date |
Last modified 2008-01-11 by System |
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