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Contribution to the stress grading in integrated power modules
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| Author(s) |
DUTARDE Emmanuel; MERMET-GUYENNET Michel; DAGDAG Selim; LEBEY Thierry; DUCHESNE Cyrille |
| Abstract |
In integrated power modules, insulating materials often constitute the weakest points. Oversizing these materials is a basic solution to guarantee both service life and reliability of the whole system. Nevertheless this oversizing is against power electronics integration. And in railways applications an increase of the voltage of semiconductor devices is observed leading to new problems both at the power module and at the packaging levels. New methods and solutions have to be found to accompany the trend which consists at the same time to increase the power density and the voltage. Among other problems stress gradation must be achieved. It's within this framework that we develop the work we present in the following. Triple points are one of the main causes of failures in high voltage power electronics modules. Such points take place where discontinuities occur in the electrical parameters (both permittivity and conductivity) leading to electric stresses enhancement. In power module a classical example is the interface between the ceramic substrate, the encapsulation gel and the metallization. This triple interfaces is usually named "triple point" and is the key for reliability. These stresses enhancement must be controlled in order to avoid dielectric breakdown or partial discharges ignition i.e. phenomenon leading to a reduction of the service life of the module. |
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| Filename: | 0407-epe2007-full-16423443.pdf |
| Filesize: | 1.501 MB |
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| Type |
Members Only |
| Date |
Last modified 2008-01-11 by System |
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